The work aims to study effects of the compound coordination agent consisting of Disodium Ethylenediamine Tetraacetate (EDTA-2Na), Sodium Ethylenediamine Tetramethylene Phosphonic (EDTMPS) and Ammonium Citrate (C6H5O7(NH4)3) on deposition rate, stability of plating solution as well as structure and properties of gold plating provided with different concentration and pH. The Cu-Ni-Pd metal layer was pre-plated on resin substrate by electroless plating, and then the gold plating was prepared. The effects of concentration and pH of compound coordination agent on deposition rate of gold plating, stability of plating solution, adhesion and brightness were studied by performing orthogonal experiment. Morphology and composition of the plating prepared in different optimized groups of plating solution formula were analyzed with scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). The optimum combination was A2C3D3B2 when gold deposition rate was taken as evaluation index, A2C2B3D2 when the stability of plating solution was taken as the evaluation index, A2D2B2C2 when the binding force was taken as the evaluation index, A3C1D2B2 when the adhesion was taken as the evaluation index. The optimum combination of four single evaluation indices was repeated. Provided with 15 g/L of EDTA-2Na, 30 g/L of C6H5O7(NH4)3 and pH of 6.0, the plating deposition rate was the fastest, stability of the plating solution was the highest, up to 6 MTO, adhesion up to level 5, brightness up to level 1. The compound coordination agent consisting of EDTA-2Na, EDTMPS and C6H5O7(NH4)3 in appropriate pH can improve the depositing speed and stability of plating solution, and thereby improve morphology of the plating.