Objective To increase the material removal rate of SiC single crystal wafer and improve the surface quality after processing. Methods Grinding fluid experiment was carried out,and the range method was used to get the optimal proportion of grinding fluid and the importance order of the influencing factors for the removal rate in the grinding fluid composition. Single factor tests were performed for the major influencing factors and their influences on the material removal rate were investigated. Results The weight of the grinding fluid was 50 g, and the optimal formula of the grinding fluid was: 9 g grind assistant agent, 7 g dispersing agent, 5 g thickening agent, 3 g lubricant, 3 g abrasive A and 5 g abrasive B, the other components were all blending agents. The particle size of abrasive A and abrasive B was both W28. Conclusion The main factor affecting the material removal rate was the particle size of abrasive. The larger the size, the higher the material removal rate.