Objective To prepare the polypyrrole film on the copper surface and study its corrosion resistance in 3. 5% NaCl solution. Methods Polypyrrole films were electrodeposited on the copper surface using potentiostatic, galvanostatic and cyclic voltammetry electrochemical techniques. Scanning electron microscope was used to observe the surface morphologies of polypyrrole. The anticorrosion performance of polypyrrole films was studied by the potentiodynamic polarization curves and long-term immersion test. Results Compact and highly adhesive polypyrrole film with cauliflower shaped structure could be formed on the copper surface by all the three methods. The polarization curves of Polypyrrole film in 3. 5% NaCl solution showed passivation region, which was different from that of bare copper. The corrosion potentials of polypyrrole films formed at 0. 659 V,60 min and 1 mA,60 min were higher by 50 mV and 150 mV than that of bare copper, respectively. Compared to the bare copper, the anodic dissolution current density of polypyrrole films was reduced by about one order of magnitude. In the long-term immersion test, the corrosion rate of copper with polypyrrole film was lower than that of bare copper. Conclusion Polypyrrole film could delay the corrosion of copper. The film prepared by potentiostatic technique provided a better protection performance.