基于Cu晶薄膜修饰层和多孔Ag层的低温键合方法

肖金, 罗佳, 方掩, 陈思源, 侯晓丽, 钟赫

Low-temperature Bonding Methods Based on Cu Crystal Thin Film Modification Layers and Porous Ag Layers

XIAO Jin, LUO Jia, FANG Yan, CHEN Siyuan, HOU Xiaoli, ZHONG He

表面技术 . 2026, (6): 260 -269 . DOI: 10.16490/j.cnki.issn.1001-3660.2026.06.020