Cu/diamond复合材料平面研磨实验研究
赵翠翠, 刘成炜, 于晓琳, 焦可如, 黄树涛
Experimental Study of Surface Lapping of Cu/diamond Composites
ZHAO Cuicui, LIU Chengwei, YU Xiaolin, JIAO Keru, HUANG Shutao
表面技术
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2025, (10): 208
-224
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DOI: 10.16490/j.cnki.issn.1001-3660.2025.10.017
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