金属钼圆基片平面研磨及其表面创成机理研究

阎秋生, 陈缘靓, 夏江南, 雒梓源, 汪涛

Planar Lapping Properties and Surface Formation Mechanism of Metal Molybdenum Wafer Substrates

YAN Qiusheng, CHEN Yuanjing, XIA Jiangnan, LUO Ziyuan, WANG Tao

表面技术 . 2024, (12): 181 -192 . DOI: 10.16490/j.cnki.issn.1001-3660.2024.12.015