基于石墨烯阻挡层Cu-In微纳米层超声波键合技术

黄锡峰, 王运明, 张武

Ultrasonic Bonding Technology Based on Graphene Barrier Layer Cu-In Micro and Nano Layers

HUANG Xi-feng, WANG Yun-ming, ZHANG Wu

表面技术 . 2023, (12): 456 -463 . DOI: 10.16490/j.cnki.issn.1001-3660.2023.12.040