Cu掺杂类金刚石薄膜应力降低机制的第一性原理研究
张而耕, 牛帅, 陈强, 潘文高, 李朝阳
First-principles on Stress Reduction Mechanism of Copper Doped Diamond-like Carbon Films
ZHANG Er-geng, NIU Shuai, CHEN Qiang, PAN Wen-gao, LI Chao-yang
表面技术
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2020, (2): 295
-300
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DOI: 10.16490/j.cnki.issn.1001-3660.2020.02.037