化学机械抛光工艺参数对氧化锆陶瓷抛光速率的影响

王光灵, 刘卫丽, 刘宇翔, 孔慧, 霍军朝, 宋志棠

Effects of Chemical-mechanical Polishing Parameters on Material Removal Rate of Zirconia Ceramic

WANG Guang-ling, LIU Wei-li, LIU Yu-xiang, KONG Hui, HUO Jun-chao, SONG Zhi-tang

表面技术 . 2018, (9): 266 -271 . DOI: 10.16490/j.cnki.issn.1001-3660.2018.09.035