硅晶圆分层划片工艺试验研究

硅晶圆分层划片工艺试验研究

尹韶辉, 杨宏亮, 陈逢军, 耿军晓, 张俊杰

Experimental Research on Step Cut Process of Silicon Wafer

YIN Shao-hui, YANG Hong-liang, CHEN Feng-jun, GENG Jun-xiao, ZHANG Jun-jie

表面技术 . 2018, (7): 1 -7 . DOI: 10.16490/j.cnki.issn.1001-3660.2018.07.001