NH4HF2对铁电沉积过程的影响

方小红, 杨凯华, 潘秉锁, 田永常

表面技术 ›› 2014, Vol. 43 ›› Issue (3) : 54-58.

PDF(3579 KB)
PDF(3579 KB)
表面技术 ›› 2014, Vol. 43 ›› Issue (3) : 54-58.

NH4HF2对铁电沉积过程的影响

  • 方小红, 杨凯华, 潘秉锁, 田永常
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Effect of NH4HF2 on the Cathodic Process of Iron Electrodeposition

  • FANG Xiao-hong, YANG Kai-hua, PAN Bing-suo, TIAN Yong-chang
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摘要

目的 研究稳定剂 NH4HF2 对铁电结晶过程的影响。 方法 采用线性电位扫描伏安法、单电位阶跃计时电流法、电化学交流阻抗谱等技术,研究含不同浓度 NH4HF2 的镀铁溶液中,铁在玻碳电极上的电沉积行为。 结果 随着 NH4HF2 浓度的增加,铁沉积的阴极极化变小。 在-1 . 225 ~-1 . 300 V 阶跃电位范围内,铁在玻碳电极上的电结晶都遵循三维瞬时成核理论,稳定剂浓度的变化不会改变其成核机理。随着 NH4HF2 浓度的增加,晶核垂直生长速率和双电层电容明显增大,溶液 / 电极界面电荷传递电阻显著降低,而溶液电阻呈小幅度降低。 结论 稳定剂 NH4HF2 的加入可促进 Fe2+的电沉积,并提高晶核的垂直生长速率。

Abstract

Objective To understand the effect of NH4HF2 on the cathodic process of iron electrodeposition. Methods Linear sweep voltammetry, single-potential step chronoamperometry and AC impedance spectroscopy were adopted to study the electrocrystallization of iron in plating solutions containing different concentrations of NH4HF2 . Results With the increase in the concentration of NH4HF2 , the cathodic polarization of iron electrodeposition was decreased; in the Step-potential range of-1. 225 ~-1. 300 V, the electrocrystallization of iron on glassy carbon electrode followed 3D instantaneous nucleation regardless of the concentration of NH4HF2 ; when the concentration of NH4HF2 increased, the outward growth rate of crystal nucleus and the double layer capacitance were enhanced, however the charge transfer resistance of solution / cathode interface was obviously decreased and the solution resistance was slightly declined. Conclusion The addition of NH4HF2 could accelerate the electrodeposition of iron and increase the outward growth rate of crystal.

关键词

铁电沉积; 稳定剂; 成核机理; 交流阻抗

Key words

iron electrodeposition; stabilizing agent; nucleation mechanism; AC impedance spectroscopy

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导出引用
方小红, 杨凯华, 潘秉锁, 田永常. NH4HF2对铁电沉积过程的影响[J]. 表面技术. 2014, 43(3): 54-58
FANG Xiao-hong, YANG Kai-hua, PAN Bing-suo, TIAN Yong-chang. Effect of NH4HF2 on the Cathodic Process of Iron Electrodeposition[J]. Surface Technology. 2014, 43(3): 54-58

基金

中央高校基本科研业务费专项资金资助( CUGL130211)

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