借助 25 ℃ 下的 Cu-H₂O,Ni-H₂O 和 W-H₂O 的 E-pH 图,说明了电镀 Cu,W,Ni 的可能性及范围,并重点分析了电镀 Cu-W-Ni 合金的可能性。 Cu-Ni 能在 Cu-H₂O 与 Ni-H₂O 系 E-pH 图叠合形成的共沉积区里析出。 因 Cu-H₂O 与 W-H₂O 系的 E-pH 图叠合时无法形成 Cu-W 的共沉积区,Cu-W 不能在其对应离子的水溶液中析出,但 Ni-W 能在 Ni²⁺,WO₄2-水溶液里诱导共沉积。 理论和实验证明,在含 Cu²⁺,Ni²⁺,WO₄2-的水溶液中能电镀制备 Cu-W-Ni 合金。

Theoretically expression of Cu, Ni, W and Cu-W-Ni alloys electrodeposition possibility were thermodynamically analyzed by means of the potential-pH plots of Cu-H₂O, Ni-H₂O and W-H₂O at 25 ℃ normal temperature. It is found that Cu-Ni alloys can be deposited together in the thermodynamical stable region of the Cu-H₂O, Ni-H₂O potential-pH plots. Cu-W alloys aren’t deposited without no thermodynamical stable region of the Cu-H₂O, W-H₂O potential-pH plots, only if Cu-W-Ni induced electrodeposition under the Ni²⁺circumstances. It is possible that Ni-W alloys are prepared by the electrodeposition in the theory and experiment, which will be new method and theory for Cu-W-Ni serial contact materials’ preparation.