厚钛过渡层缓解铜基上热丝 CVD 金刚石薄膜内应力

赵齐, 代明江, 韦春贝, 邱万奇, 侯惠君, 谭笛

表面技术 ›› 2013, Vol. 42 ›› Issue (5) : 19-23.

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PDF(5022 KB)
表面技术 ›› 2013, Vol. 42 ›› Issue (5) : 19-23.

厚钛过渡层缓解铜基上热丝 CVD 金刚石薄膜内应力

  • 赵齐1, 代明江2, 韦春贝2, 侯惠君2, 谭笛2, 邱万奇3
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Thick Titanium Interlayer Remitting Stress in Diamond Films Deposited on Copper Substrate by Hot Filaments Chemical Vapor Deposition

  • ZHAO Qi1, DAI Ming-jiang2, WEI Chun-bei2, HOU Hui-jun2, TAN Di2, QIU Wan-qi3
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摘要

以紫铜为基体,在紫铜上先采用磁控溅射技术镀一层金属钛,再以 H2 和 CH4 作为反应气体,采用热丝化学气相沉积法( HFCVD) 在钛过渡层上合成金刚石薄膜,研究不同钛过渡层厚度对金刚石薄膜质量的影响。 利用 X 射线( XRD) 、激光拉曼光谱( Raman) 、扫描电镜( SEM) 分析薄膜的结构、成分和表面形貌,用能谱仪( EDS) 对热处理前后样品的表面进行了元素分析。 研究发现,当钛过渡层厚度为 3 μm 时,生成的金刚石薄膜受到较大内应力而发生破裂;当钛过渡层厚度为 25 μm 时,金刚石薄膜质量较好,薄膜受一定内应力,但没有破裂;850 ℃ 左右保温热处理 12 h,铜原子与钛原子发生了扩散。

Abstract

Diamond films were deposited on metal copper substrate with a buffer layer of titanium with the mixture gas of methane and hydrogen by hot filaments chemical vapor deposition ( HFCVD) . Effects of different thickness of titanium layer on diamond films by HFCVD were investigated. The components of films were investigated using X-ray diffraction ( XRD) and laser Raman spectrum, and the surface morphology and structure were observed by scanning electron microscopy ( SEM) . The surface element of samples processed by heat treatment were analyzed using energy disperse spectroscopy ( EDS ) . The results show that when the thickness of titanium layer is 3 μm, the diamond film breaks down due to large internal stress. When the thickness of titanium increases to 25 μm, the diamond film is good and don爷 t break down with the existence of internal stress in the membrane. The diffusion between copper and titanium happens when the sample is processed by heat treating at 850 ℃ for

关键词

金刚石薄膜; 钛过渡层; 内应力; 热丝化学气相沉积

Key words

diamond films; titanium interlayer; internal stress; hot filaments chemical vapor deposition

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导出引用
赵齐, 代明江, 韦春贝, 邱万奇, 侯惠君, 谭笛. 厚钛过渡层缓解铜基上热丝 CVD 金刚石薄膜内应力[J]. 表面技术. 2013, 42(5): 19-23
ZHAO Qi, DAI Ming-jiang, WEI Chun-bei, QIU Wan-qi, HOU Hui-jun, TAN Di. Thick Titanium Interlayer Remitting Stress in Diamond Films Deposited on Copper Substrate by Hot Filaments Chemical Vapor Deposition[J]. Surface Technology. 2013, 42(5): 19-23

基金

广东省科技计划项目(2011A081301003)

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