氮化铜薄膜制备中氮气比例对其结构及微观力学性能的影响

龚鹏, 范真, 丁建宁, 程广贵, 袁宁一, 凌智勇

表面技术 ›› 2013, Vol. 42 ›› Issue (5) : 15-18,31.

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PDF(4268 KB)
表面技术 ›› 2013, Vol. 42 ›› Issue (5) : 15-18,31.

氮化铜薄膜制备中氮气比例对其结构及微观力学性能的影响

  • 龚鹏1, 程广贵1, 凌智勇1, 范真2, 丁建宁3, 袁宁一4
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Effect of Nitrogen Partial Pressure on the Structure and Micro-mechanical Properties of Cu3N Films

  • GONG Peng1, CHENG Guang-gui1, LING Zhi-yong1, FAN Zhen2, DING Jian-ning3, YUAN Ning-yi4
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摘要

采用射频磁控溅射方法在玻璃基底上制备氮化铜薄膜,研究了氮氩混合气体中的氮气比例对薄膜择优生长取向、表面晶粒尺寸和微观力学性能的影响。 结果表明:低氮气比例时,薄膜的纳米力学性能比较差;随着氮气比例的增加,氮化铜薄膜的择优生长晶面从( 111 ) 晶面转变为( 100 ) 晶面,晶粒尺寸变小, 显微硬度增加,弹性模量则是先增加,后减小。

Abstract

Copper nitride thin films were prepared on silicon glass substrates by means of RF magnetron sputtering deposition, and then the effects of nitrogen partial pressure in a fixed-total N2-Ar mixture sputtering gas flow on the preferential crystalline orientation, the size of surface grain and micro-mechanical properties were investigated. It is showed that when the nitrogen partial pressure is low, the nano-mechanical property of the thin film is poor. As nitrogen partial pressure improves the preferential orientation transforms from plane (111 ) to plane (100 ) , the crystalline grain size shrinks and the elastic modulus first increases but then decreases.

关键词

氮化铜薄膜; 射频磁控溅射; 微结构; 纳米力学

Key words

copper nitride thin film; r. f . magnetron sputtering; micro structure; nano-mechanical

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龚鹏, 范真, 丁建宁, 程广贵, 袁宁一, 凌智勇. 氮化铜薄膜制备中氮气比例对其结构及微观力学性能的影响[J]. 表面技术. 2013, 42(5): 15-18,31
GONG Peng, FAN Zhen, DING Jian-ning, CHENG Guang-gui, YUAN Ning-yi, LING Zhi-yong. Effect of Nitrogen Partial Pressure on the Structure and Micro-mechanical Properties of Cu3N Films[J]. Surface Technology. 2013, 42(5): 15-18,31

基金

国家自然科学基金项目(51272033)

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