采用硫酸盐系电解液在 BAg50 CuZn 钎料表面电镀 Sn,考察了电流密度、镀液温度、阴阳极间距、超声波功率及超声波频率对 AgCuZn 钎料电镀锡溶液电阻的影响,得出了较佳的工艺条件,并对该条件下制备的锡电镀层的微观表面形貌进行了观察。 结果表明,施镀时间一定时,随着电流密度或超声波频率的增大,溶液电阻逐渐增大;阴阳极间距增大时,溶液电阻呈现先减小、后增大的趋势。 在较佳工艺条件下施镀,可获得表面平整、致密的 Sn 电镀层。

Tin films were electroplated on BAg50 CuZn brazing filler metal substrate using sulfate salt electrolyte. The effect of current density, bath temperature, electrode distance, ultrasonic power and frequency on resistance of tin electroplating electrolyte were analyzed. The better conditions of electroplating tin on AgCuZn brazing filler metal were obtained. The surface morphology of tin electroplating coating was examed. The results indicate that the electrolyte resistance increase with increasing of current density and ultrasonic frequency. The resistance decreases firstly and then increases with increasing of electrode distance. A smooth and uniform surface morphology of tin electroplated film is obtained under the better conditions.