采用硫酸铜溶液对湿态磷化膜进行置换镀铜封孔,发现该方法是可行的。 铜封闭操作可以增加磷化膜的厚度,提高其耐蚀性能,减轻后续水洗的强度。 置换时间宜短,硫酸铜溶液浓度宜低,推荐的置换镀铜封闭磷化膜工艺是:采用浓度 2% 的硫酸铜溶液,在常温下浸渍 3 ~ 5 min。

The replacement copper plating on the phosphating film was carried out in copper sulfate solution. The results showed that it爷 s feasible to plate copper on phosphating film. After plating the strength and the corrosion resistance of the as-prepared phosphating film can be increased. The time of the plating should be short and the concentration of the copper sulfate should be low. The suggested experiment parameters are listed as follows: the concentration of copper sulfate is 2 % , the temperature is room temperature and the time is 3 ~ 5 min.