采用电弧离子镀技术,以W18Cr4V 高速钢为基体,调整基体负偏压,制得多个复合TiAlN 薄膜试样,研究了基体负偏压对薄膜微观组织形貌、物相组成、晶格位向、硬度、厚度和沉积速率的影响。结果表明,过高或过低的负偏压会使得膜层表面不平整,显微硬度下降。当负偏压为200 V 时,膜层的沉积速率最大;负偏压为150 V 时,有利于薄膜(111)晶面的择优取向生长,且TiAlN 膜的硬度最高。

TiAlN thin films were fabricated via arc ion plating on the W18Cr4V high-speed steel under different negative biases. The influence of negative bias on the microstructure, phase, and crystalline orientation, hardness, and deposition rate of the films were investigated. The results show that the films have a coarse surface at too high or too low biases, resulting in lower hardness. The largest deposition rate is achieved at -200 V bias. The TiAlN thin film has a (111) preferred orientation when deposited at -150 V bias, where the largest hardness is achieved.