化学机械抛光液的发展现状与研究方向

彭进; 夏琳; 邹文俊

表面技术 ›› 2012, Vol. 41 ›› Issue (4) : 95-98.

综述·专论

化学机械抛光液的发展现状与研究方向

彭进, 夏琳, 邹文俊

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Research status and Prospect of Chemical Mechanical Polishing Slurry

PENG Jin, XIA Lin, ZOU Wen-jun

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文章历史 +

摘要

简述了化学机械抛光液的主要成分及其作用;综述了近年来国内外化学机械抛光液的发展现状,主要介绍了二氧化硅胶体抛光液、二氧化铈抛光液、氧化铝抛光液、纳米金刚石抛光液。最后指出,化学机械抛光液未来应向环保化、精细化以及专门化的方向发展。

Abstract

The main composition and function of chemical mechanical polishing(CMP)slurry were elaborated. The developing status of CMP surry in recent years was summarized. It mainly introduced SiO2 sol polishing slurry, Al2O3 polishing slurry, CeO2 polishing slurry, nanodiamond polishing slurry. Finally, the research trends of CMP slurry were pointed out which were environmental protection, refinement, hyperspecialization.