乙二醇介质中铜微粉表面化学镀银的研究

李雅丽, 付新, 党蕊

表面技术 ›› 2012, Vol. 41 ›› Issue (3) : 60-62.

PDF(2646 KB)
PDF(2646 KB)
表面技术 ›› 2012, Vol. 41 ›› Issue (3) : 60-62.
研究与探索

乙二醇介质中铜微粉表面化学镀银的研究

  • 李雅丽, 付新, 党蕊
作者信息 +

Study on the Eletcroless Silver Plating on Copper Powders in Ethylene Glycol Medium

  • LI Ya-li, FU Xin, DANG Rui
Author information +
文章历史 +

摘要

在新生成的铜微粉表面化学镀银,用扫描电镜、X射线衍射仪、动态光散射粒径测试仪和热重仪对粉体进行表征和性能测试,分析了粉体导电性、抗氧化性及粒径大小和分布的影响因素。结果表明:在乙二醇介质中采用液相还原法,通过葡萄糖预还原,用甲醛进行二次还原,控制银与铜物质的量之比为2:1,可得到抗氧化性、导电性良好的银包铜微粉。

Abstract

The surface of copper powers was plated with silver. The silver-coated copper power was characterized and its performances were tested by XRD,DLS and TG.The influence factors of conductivity, antioxidativity and its particle size were analyzed. The results show that silver-coated copper powders are prepared by liquid chemical reduction methed, which glucose as prereductant and formaldehyde as reductant in ethylene glycol system. The mole ratio of copper and silver is 2:1. Silver-coated copper powders exhibit excellent conductivity and antioxidativity.

关键词

乙二醇;化学镀银;银包铜粉;导电浆料

Key words

ethylene glycol; eletcroless plating silver; silver-coated copper powder; electronic paste

引用本文

导出引用
李雅丽, 付新, 党蕊. 乙二醇介质中铜微粉表面化学镀银的研究[J]. 表面技术. 2012, 41(3): 60-62
LI Ya-li, FU Xin, DANG Rui. Study on the Eletcroless Silver Plating on Copper Powders in Ethylene Glycol Medium[J]. Surface Technology. 2012, 41(3): 60-62

基金

陕西省自然科学基金(2011JM6005)

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