采用动电位扫描、电化学阻抗谱、循环伏安法,研究了十二烷基硫醇分子在纯铜电极表面的自组装行为以及形成的自组装膜对铜的缓蚀作用。电化学测试结果显示:十二烷基硫醇自组装膜通过阻碍电子穿过电极/溶液界面,以及阻挡腐蚀介质与铜基底的接触,有效地抑制了铜的腐蚀;随着组装时间的延长,自组装膜更为完整,对铜的腐蚀抑制效率更高。

The assembling behavior and corrosion inhibition of docecanethiol SAMs on pure copper surface were investigated by potentiodynamic polarization, impedance spectroscopy and cyclic voltametry. The results show that dodecanethiol SAMs prevent electrons pass through electrode/solution interface and block the contact between corrosion ions and metal surface, the SAMs have obvious inhibition effect on pure copper; The SAMs are more complete, and it’s inhibition efficiency increases with assembling time.