目的 明确不同电镀工艺参数对钨丝表面电镀镍层的影响。方法 在45 ℃、2.5 A/dm2的温度和电流密度条件下,对钨丝开展电镀镍研究,获得了结合强度优良的镀镍层,利用电子放大镜、扫描电镜、能谱分析对镀镍层进行表征,明确了电镀时间、盐酸体积分数和主盐浓度对镀镍层的完整性、表面形貌、厚度和槽电压的影响。结果 研究表明,镀镍层厚度随时间延长、盐酸体积分数和主盐质量浓度增加而增加。电镀40~80 s时,镀镍层逐渐均匀致密,电镀时间超过120 s后镀镍层逐渐出现不均匀现象。镀液中不添加盐酸时无法获得完整的镀镍层,盐酸体积分数为10 mL/L时,可形成完整的镀镍层,盐酸体积分数增加到20~40 mL/L时,镀镍层逐渐致密平整,且槽电压随盐酸体积分数增加而逐渐降低且稳定。主盐质量浓度低于100 g/L时,镀镍层无法完全覆盖钨丝基体,槽电压随主盐质量浓度增加而降低且平稳。结论 综合考虑,当电镀时间100 s、盐酸体积分数20 mL/L、主盐质量浓度100 g/L时可在钨丝表面获得综合质量优异的镀镍层。
Abstract
At present, relevant researches focusing on the nickel electroplating technology for tungsten wires are still rather limited. Nevertheless, tungsten probes are widely utilized in the probe card industry, which renders the research on nickel electroplating of tungsten wires of great practical value and exploratory significance. The work aims to systematically investigate the effects of various electroplating process parameters on the nickel coatings deposited on tungsten wire surfaces.
Nickel electroplating experiments on tungsten wires were implemented under a fixed temperature of 45 ℃ and a current density of 2.5 A/dm2, and nickel coatings with outstanding interfacial bonding strength were successfully prepared in the experiment. A series of characterization methods including electronic magnifier observation, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) were adopted to analyze the as-deposited nickel layers. The work quantitatively clarifies how three key parameters, namely electroplating time, hydrochloric acid concentration and main salt concentration, affect four critical indicators of nickel coatings: coating integrity, surface morphology, coating thickness and plating cell voltage.
The experimental results reveal that the thickness of nickel coatings increases with the extension of electroplating duration, as well as the rising concentration of hydrochloric acid and main salt. Within the electroplating time range from 40 seconds to 80 seconds, the nickel coating becomes progressively uniform and compact as the plating process proceeds. However, once the electroplating time exceeds 120 seconds, continuous metal deposition will occur over an excessively long period, which gradually triggers uneven distribution and poor flatness of the nickel coating.
No intact and continuous nickel coating can be obtained on tungsten substrates if no hydrochloric acid is added to the plating bath. A fully covered nickel layer will form when the hydrochloric acid concentration reaches 10 ml/L. When the hydrochloric acid concentration is adjusted within the range of 20 mL/L to 40 mL/L, the nickel coating turns denser and smoother with the increase of hydrochloric acid dosage. Meanwhile, the plating cell voltage declines gradually and maintains a stable level as hydrochloric acid concentration rises. Hydrochloric acid plays two vital roles in the electroplating system: it stabilizes the pH value of plating solution, which contributes to the formation of smooth and delicate nickel coatings, and additionally, it activates the anode to guarantee stable metal ion dissolution.
With regard to the main salt, if its concentration is lower than 100 g/L, the tungsten wire substrate cannot be fully covered by nickel deposition, and the plating cell voltage decreases and tends to stay steady as the main salt concentration goes up. Nickel chloride (NiCl2) is selected as the main salt in this plating system. A relatively high concentration of nickel chloride supplies abundant nickel ions in the bath, facilitating the close and ordered arrangement of nickel ions during electrodeposition, so as to construct nickel coatings with superior microstructure and comprehensive quality.
After comprehensive evaluation of coating integrity, surface flatness, thickness uniformity and stable operating voltage, the optimal combination of process parameters is determined: electroplating time of 100 s, hydrochloric acid concentration of 20 ml/L and main salt concentration of 100 g/L. Under this optimized parameter combination, nickel coatings with excellent overall performance can be successfully fabricated on the surface of tungsten wire substrates.
关键词
钨丝 /
电镀镍 /
工艺参数 /
形貌 /
镀层性能
Key words
tungsten wire /
electroplated nickel /
process parameter /
morphology /
coating performance
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基金
国家自然科学基金（52274377,52304391); 辽宁省自然科学基金（2023-MSBA-133）; 中央高校基本科研业务专项资金（N2402010）; 福建省自然科学基金（2025J01384）; 江苏省基础研究计划（BK20243005）
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