目的 高性能滚动轴承工作面的精度和表面完整性直接决定装备的性能、质量和可靠性。已有的全口径化学机械抛光虽然可以实现较高的抛光效率和精度,但通用性有待改善。为此,本文提出了子口径化学机械抛光。方法 以一款典型的圆柱滚子轴承的内套圈外滚道为研究对象,介绍其抛光原理,采用有限元仿真分析抛光压力分布,建立材料去除速率模型和形状演化模型,并通过抛光实验验证模型。采用白光干涉仪、圆度/圆柱度测量仪,分别检测抛光前后滚道表面形貌、平均表面粗糙度及形状精度。结果 有限元分析显示,加工时滚道中心约90%区域压力分布均匀,可实现均匀抛光。材料去除速率模型表明,其与抛光垫径向位移、转速呈线性关系。形状演化模型表明,抛光可降低滚道表面凹凸不平,改善形状精度。经过2 h抛光,平均表面粗糙度Sa由141.97 nm下降至7.42 nm,降幅达94.8%。圆度误差RONt由2.03 μm下降至1.88 μm,降幅达7.4%,圆柱度误差CYLt由5.83 μm下降至5.18 μm,降幅达11.1%。结论 本文提出了一种子口径化学机械抛光,实现了套圈滚道的高精度抛光,为轴承套圈滚道这类典型回转表面的高精度加工提供了一种通用性强的方法。
Abstract
The shape accuracy and integrity of the working surfaces of high-performance rolling bearings (such as bearing rings' raceways) directly determine the performance, quality, and reliability of equipment. For bearing rings' working surfaces, the conventional full-aperture chemical mechanical polishing (CMP) method can achieve high polishing efficiency and good surface quality. However, the polishing pressure relies on interference compression of the polishing pad, which requires custom-designed polishing heads for workpieces of different shapes and sizes and thus limits the versatility of the polishing heads. To address this issue, the work aims to propose a sub-aperture CMP method that can achieve the polishing of bearing rings' raceways through the design of a small polishing head and trajectory planning. Firstly, the theoretical analysis of sub-aperture CMP was carried out, and the relative speed and polishing pressure were analyzed. The polishing principle was summarized as: the polishing pad of the polishing head closely fitted the bearing ring's raceway, forming a line contact. During polishing, the polishing head moved radially, compressing the polishing pad to generate polishing pressure. Both the polishing pad and the inner ring were immersed in the CMP slurry and rotated in opposite directions, and the relative speed was provided by the speed of the polishing pad (i.e., the speed of the polishing head) and the speed of the inner ring. Meanwhile, the polishing head performed an axial reciprocating motion. The chemical reagents in the CMP slurry (e.g., oxidizers and complexing agents) provided chemical action, reacting with the surface of the bearing ring's raceway to form a surface film with low mechanical strength that was readily to remove. Abrasives in the CMP slurry were embedded on the polishing pad, and under the synergistic effect of polishing pressure and relative motion, they removed the surface film. When the chemical reactions and mechanical forces were well coordinated, high-quality and efficient polishing of the ring's raceway were achieved. The finite element analysis results of the polishing pressure distribution showed that sub-aperture CMP could achieve a relatively uniform polishing pressure distribution within about 90% of the central area when polishing the ring's raceway, enabling relatively uniform polishing. Then, based on the Preston formula, the material removal rate (MRR) model and the shape evolution model of sub-aperture CMP were established. The MRR model showed that the MRR of sub-aperture CMP had a linear relationship with the radial displacement of the polishing pad, the speed of the polishing pad, and the speed of the ring. The shape evolution model showed that larger convex points on the ring's raceway produced a larger radial displacement of the polishing pad and a higher MRR, thereby improving shape accuracy. Then, with the inner ring's raceway of a cylindrical roller bearing as the research object, the polishing experiment was carried out. The fitting results of the MRR showed that it increased linearly with the increase of the radial displacement of the polishing pad and the speed of the polishing pad, which preliminarily verified the MRR model. After polishing for 2 hours under the condition that the radial displacement of the polishing pad was 0.1 mm and the speed of the polishing pad was 160 r/min, the average surface roughness Sa of the ring's raceway decreased from 141.97 nm to 7.42 nm, with a decrease of 94.8%. The surface of the ring's raceway became smooth. The roundness error RONt decreased from 2.03 μm to 1.88 μm, with a decrease of 7.4%, and the cylindricity error CYLt was reduced from 5.83 μm to 5.18 μm, with a decrease of 11.1%. The surface quality and shape accuracy were effectively improved. In addition, the proposed sub-aperture CMP method was also applied to the outer ring's raceway of a cylindrical roller bearing. In conclusion, the sub-aperture CMP method proposed in this work enables high-precision polishing of bearing rings' raceways. Compared with the existing full-aperture CMP, the sub-aperture CMP provides better versatility for polishing heads, offering a more generalizable approach for high-precision machining of typical revolution surfaces such as bearing rings' raceways.
关键词
化学机械抛光 /
子口径 /
超精密 /
轴承 /
套圈滚道
Key words
chemical mechanical polishing /
sub-aperture /
ultra-precision /
bearing /
ring's raceway
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基金
国家自然科学基金（52235004,U2541265）; 高性能工具全国重点实验室开放课题研究基金（GXNGJSKL-2026-03）; 中央高校基本科研业务费（2682025CG001,2682024CG007）
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