叠层片式电子元器件防爬镀涂层研究进展

吴梦瑜; 李燕飞; 刘志文; 李亚玲; 袁俊霞; 杨丽霞

doi:10.16490/j.cnki.issn.1001-3660.2026.10.014

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表面技术 ›› 2026, Vol. 55 ›› Issue (10) : 163-181. DOI: 10.16490/j.cnki.issn.1001-3660.2026.10.014

功能表面及技术

叠层片式电子元器件防爬镀涂层研究进展

吴梦瑜¹, 李燕飞², 刘志文¹, 李亚玲³, 袁俊霞¹, 杨丽霞^1,*

作者信息 +

Research Progress on Anti-plating Creep Coatings for Multilayer Chip Electronic Components

WU Mengyu¹, LI Yanfei², LIU Zhiwen¹, LI Yaling³, YUAN Junxia¹, YANG Lixia^1,*

Author information +

文章历史 +

摘要

叠层片式电子元器件正向微型化、集成化快速发展,并广泛应用于5G通信、新能源汽车、航空航天等领域。在元器件端电极电镀过程中,金属离子会沿端电极向中心区域发生非预期的延伸沉积,形成“爬镀”现象。爬镀使元器件的电气性能劣化,导致焊接可靠性下降,甚至引发短路失效,成为制约产品可靠性的关键难题。绝缘涂层技术凭借其物理隔离作用,能有效抑制元器件瓷体表面金属离子还原及水解,成为解决爬镀问题的有效方法。本文系统综述了叠层片式电子元器件端电极爬镀的形成原因,重点分析了无机非金属涂层、有机高分子涂层的核心性能参数、技术优势及局限性。进一步地,从涂层的耐热性、耐腐蚀性、耐磨性、吸水率、结合强度及长效稳定性等方面,深入探讨了防爬镀涂层在镀液环境中的使役行为、高温焊接过程中的热稳定性,以及在湿热条件下的老化行为。最后,对防爬镀涂层的发展方向进行了展望,以期为高性能、长寿命防爬镀涂层的研发与应用提供理论支撑,推动叠层片式电子元器件可靠性的持续提升。

Abstract

The miniaturization and integration of multilayer chip electronic components (MLCCs, MLCIs, MLCVs) are critical for advanced applications in 5G, electric vehicles, and aerospace. A major reliability challenge in these components is "plating creep", a defect occurring during termination electrode electroplating, where metal ions migrate laterally from the electrode edge onto the ceramic body. This unwanted metallic deposition degrades electrical performance, compromises solderability and causes short circuits. Insulating coatings have emerged as the primary solution, acting as a physical barrier to prevent metal ion reduction and ceramic hydrolysis.
This review systematically examines the mechanisms behind plating creep and the coating strategies developed to resolve plating creep. The defect originates from residual metal ions present on the sintered ceramic surface and reduced by active hydrogen generated during the cathodic electroplating process. The core of the discussion provides a comprehensive comparative analysis on the two primary categories of protective coatings: inorganic non-metallic coatings and organic polymer coatings. Inorganic coatings, encompassing glass-based systems, phosphate conversion films, and ceramic oxides, are characterized by exceptional thermal stability, high hardness, superior chemical resistance, and excellent barrier properties. However, their application is often constrained by high processing temperatures, inherent brittleness, environmental concerns with certain formulations, and challenges in depositing uniform thin films on increasingly miniaturized geometries. In contrast, organic polymer coatings, such as silicone resins, epoxy resins, and polyimides (PI), offer distinct advantages in processing versatility, adhesion, flexibility, and lower-temperature curing. Organosilicones excel in thermal stability and hydrophobicity, epoxy resins are favored for their strong adhesion and cost-effectiveness, while polyimides represent the high-performance benchmark with outstanding thermal endurance and mechanical strength. The general limitations of organic systems include higher moisture absorption rates, potential chemical degradation in acidic plating environments, and with the exception of high-performance PIs, these systems have limited tolerance to soldering temperatures and prolonged thermal exposure.
A detailed evaluation of key service performance parameters is central to assessing coating efficacy and longevity. These parameters include heat resistance, which is crucial for withstanding reflow soldering and high-temperature operation, corrosion resistance essential for enduring aggressive electroplating baths, wear resistance required to withstand mechanical abrasion during dynamic processing, water absorption rate, a critical factor affecting dimensional stability and long-term insulation, long-term stability under coupled hygrothermal and thermomechanical stresses and the coating-substrate adhesion strength, which directly determines the coating's resistance to delamination and its overall reliability. The performance in these areas is fundamentally governed by the coating's material composition, key microstructural features like crosslink density and filler incorporation, and the quality of its interfacial adhesion with the ceramic substrate.
Future research is directed toward several pivotal avenues to overcome current limitations. This entails a deeper fundamental investigation into coating failure mechanisms during cathodic electrodeposition, focusing on ion penetration, polymer swelling, and interfacial delamination in operational environments. The development of advanced organic-inorganic hybrid or nanocomposite coatings is promising, aiming to synergistically combine the robustness of ceramics with the toughness and processability of polymers. There is also a growing need for enhanced predictive modeling of coating longevity, establishing quantitative relationships between accelerated aging tests, microstructural evolution, and macro-performance degradation to enable reliable service-life prediction. Concurrently, the field must continue to emphasize environmentally benign materials, such as fully lead-free and low-VOC systems, alongside the development of high-precision, scalable coating application techniques compatible with next-generation micro-component geometries. This review is expected to provide a theoretical foundation for developing next-generation, high-performance anti-plating creep coatings to ensure the enhanced reliability of multilayer chip electronic components.

导出引用

吴梦瑜, 李燕飞, 刘志文, 李亚玲, 袁俊霞, 杨丽霞. 叠层片式电子元器件防爬镀涂层研究进展[J]. 表面技术. 2026, 55(10): 163-181

WU Mengyu, LI Yanfei, LIU Zhiwen, LI Yaling, YUAN Junxia, YANG Lixia. Research Progress on Anti-plating Creep Coatings for Multilayer Chip Electronic Components[J]. Surface Technology. 2026, 55(10): 163-181

中图分类号： TN04

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