基于一维垂直架构设计的热界面材料研究进展

曹宏涛; 孙浩伟

doi:10.16490/j.cnki.issn.1001-3660.2026.02.015

PDF(7090 KB)

表面技术 ›› 2026, Vol. 55 ›› Issue (2) : 209-220. DOI: 10.16490/j.cnki.issn.1001-3660.2026.02.015

功能表面及技术

基于一维垂直架构设计的热界面材料研究进展

曹宏涛, 孙浩伟^*

作者信息 +

Recent Progress in 1D Vertical Architecture-designed Thermal Interface Materials

CAO Hongtao, SUN Haowei^*

Author information +

文章历史 +

摘要

随着高功率电子器件向微型化、集成化方向发展,高效热界面材料（TIMs）建立从热源（芯片）到散热器高效传热路径的研究成为突破器件散热瓶颈的关键。本文系统综述了三类垂直取向纳米结构热界面材料的最新研究进展。首先,金属纳米线阵列多集中在铜纳米线阵列的制备及其应用,对比分析了电化学沉积法和模板辅助生长法在制备过程中对阵列取向度的影响。其次,垂直碳纤维复合材料的研究在于碳纤维的长径比和界面声子匹配的优化策略。通过优化碳纤维的结构和界面性质,从而降低热阻,改善散热效果。此外,垂直碳纳米管阵列主要是利用金属催化化学气相沉积（CVD）技术生长垂直碳纳米管阵列。通过改善碳纳米管阵列的对接质量,降低热阻,进一步提升热传导效率。同时还总结了垂直碳纳米管阵列材料转移工艺的优化措施,并探讨了通过填充物质提高碳纳米管阵列的导热性能及其在实际应用中的便利性。总体来说,这些研究不仅为热界面材料的开发提供了理论支持,还为下一代电子器件的散热解决方案提供了新的思路。

Abstract

As high-power electronic devices continue to miniaturize and integrate, efficient thermal management has become a critical challenge in ensuring their reliable performance and longevity. Thermal interface materials (TIMs) are essential in addressing these challenges by providing a highly effective thermal conduction pathway between the heat source, typically the chip, and the heat sink. The ability of these materials to manage the heat flow is crucial for the operation of modern electronic devices, such as microprocessors, LEDs, and power electronics, which are characterized by high power densities and compact form factors. This paper provides a comprehensive review of recent advancements in the development of high-efficiency thermal interface materials, particularly focusing on three categories of vertically aligned nanostructured materials: metal nanowire arrays, carbon fiber composites, and carbon nanotube arrays.
The first category of metal nanowire arrays has garnered significant attention due to the potential of copper nanowires to provide excellent thermal conductivity. Copper has high thermal and electrical conductivity, making it an ideal candidate for use in TIMs. A comparative analysis of various fabrication methods, such as electrochemical deposition and template-assisted growth, reveals significant differences in the alignment and orientation of the nanowires, which play a critical role in determining the thermal performance of the material. These fabrication methods influence the uniformity of the nanowire arrays, and thus, their ability to create an efficient thermal pathway from the chip to the heat sink. Understanding these influences and optimizing the fabrication processes are crucial steps for improving the efficiency of metal nanowire-based TIMs.
The second category of TIMs discussed in this paper focuses on vertically aligned carbon fiber composites. Carbon fibers, particularly those with high aspect ratios, have shown promise in improving the thermal conductivity of TIMs. These materials benefit from the exceptional thermal properties of carbon and the unique alignment of fibers that enhances heat transfer efficiency. The optimization of the carbon fiber structure and its interface properties is critical in reducing the overall thermal resistance. Research shows that phonon matching at the interface between the carbon fibers and the surrounding materials plays a pivotal role in improving heat dissipation. By fine-tuning the fiber alignment, aspect ratio, and interfacial properties, researchers are able to significantly enhance the thermal performance of carbon fiber-based TIMs.
The third category explored in this review focuses on vertically aligned carbon nanotube (CNT) arrays. CNTs are well-known for their extraordinary thermal and mechanical properties, and their vertical alignment is particularly advantageous for efficient heat transfer. These arrays are typically synthesized by metal-catalyzed chemical vapor deposition (CVD), which allow for precise control over the alignment and density of the CNTs. A major challenge with CNT-based TIMs is improving the interfacial quality between the nanotubes and the surrounding materials. Studies demonstrate that reducing the thermal resistance at the CNT interface can significantly enhance the overall thermal conductivity of the material. Various strategies, such as incorporating filling materials into the CNT arrays and optimizing the transfer process of the CNT array materials, have been explored to address this challenge. Additionally, the incorporation of filling materials has been shown to further enhance the thermal conductivity of CNT arrays, making them even more effective as TIMs.
Overall, the advancements in these three categories of vertically aligned nanostructured thermal interface materials provide significant insights into the future of thermal management for high-performance electronic devices. By optimizing the structure, alignment, and interfacial properties of these materials, researchers are developing new solutions that can meet the increasingly demanding thermal management requirements of next-generation electronics. These studies offer both theoretical and practical guidance for the design of high-performance TIMs that can effectively address the heat dissipation challenges posed by modern electronic devices. The continued development of these materials promises to pave the way for more efficient, reliable, and compact electronic systems.

导出引用

曹宏涛, 孙浩伟. 基于一维垂直架构设计的热界面材料研究进展[J]. 表面技术. 2026, 55(2): 209-220

CAO Hongtao, SUN Haowei. Recent Progress in 1D Vertical Architecture-designed Thermal Interface Materials[J]. Surface Technology. 2026, 55(2): 209-220

中图分类号： TB332

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