目的 建立工艺参数与纳秒激光烧蚀SiCf/SiC复合材料烧蚀槽尺寸及烧蚀槽形貌的映射关系,揭示不同工艺参数条件下的烧蚀机理,明确烧蚀过程的成分变化规律,为SiCf/SiC复合材料的孔加工和槽加工提供理论指导和工艺基础。方法 通过不同激光能量密度和扫描速度的纳秒激光对SiCf/SiC复合材料进行烧蚀,采用扫描电子显微镜、激光共聚焦显微镜以及显微拉曼光谱仪对烧蚀槽形貌尺寸及物相组成进行分析,揭示纳秒激光烧蚀SiCf/SiC复合材料的烧蚀机理。结果 在选定工艺参数范围内,激光能量密度主要影响烧蚀宽度,扫描速度主要影响烧蚀深度,激光能量密度由1.78 J/cm2提高到8.89 J/cm2,烧蚀宽度提高了10.06 μm。扫描速度由800 mm/s降低到50 mm/s,烧蚀深度提高了76.12 μm。结论 纳秒激光烧蚀SiCf/SiC复合材料的主要烧蚀产物是SiO2。烧蚀槽内部由于氧分压较小,温度较高,SiC被动氧化会转变为活性氧化,生成SiO和CO等物质。此外,烧蚀过程中SiC会发生分解和蒸发,对材料中SiC的含量和结晶度造成影响。当材料吸收的单位时间激光能量输入较低时,SiC蒸发分解产生的气体反冲压力将熔融液滴抛离,在光斑附近形成半圆形溅射状。当材料吸收单位时间激光能量输入较大时,大部分熔融液滴无法离开烧蚀槽,在烧蚀槽内形成较厚的重铸层和块状堆积物。
Abstract
SiCf/SiC composites, as a new type of material with excellent properties such as high specific strength, high temperature resistance, and corrosion resistance, have become one of the preferred materials for turbine blades of next-generation aerospace engines, and have been widely used in the automotive industry, nuclear reactors, and other fields. However, their high hardness, brittleness, weak electrical conductivity and other characteristics make them processing extremely difficult. Nanosecond laser ablation is a non-contact processing with high efficiency and a wide processing range, which has a broad application prospect in the processing of ceramic matrix composites.
The quality of SiCf/SiC composites processed by a nanosecond laser is greatly affected by the process parameters. In this paper, SiCf/SiC composites were processed by a nanosecond laser with a wavelength of 355 nm, a pulse width of 15 ns, a spot radius of 15 μm, and a pulse repetition frequency of 80 kHz, and the effects of the laser energy density and the scanning speed on the size of the ablation groove and the composition of the physical phase were investigated. The morphological characteristics after ablation were analyzed by observing the microscopic ablation morphology with a field emission scanning electron microscope (HITACHI, SU5000), measuring the width and depth of the ablation grooves with a laser confocal microscope (Olympus, OLS4000). The changes of the material before and after ablation were analyzed by micro-Raman spectroscopy (Thermo Fisher, DXR Microscope) to reveal the ablation mechanism of nanosecond laser ablation of SiCf/SiC composites.
The results show that the laser energy density mainly affects the ablation width, and the scanning speed mainly affects the ablation depth within the range of the selected process parameters. The laser energy density is increased from 1.78 to 8.89 J/cm2, and the ablation width is increased by 10.06 μm. The scanning speed is decreased from 800 to 50 mm/s, and the ablation depth is increased by 76.12 μm. The main ablation product of nanosecond laser ablation of SiCf/SiC composites is SiO2. Inside the ablation bath, due to the low partial pressure of oxygen and the high temperature, the passive oxidation of SiC is transformed into active oxidation, which generates substances such as SiO and CO. In addition, SiC decomposes and evaporates during the ablation process, which affects the content and crystallinity of SiC in the material. When the laser energy input per unit time absorbed by the material is small, the gas recoil pressure generated by SiC evaporation decomposition throws the molten droplets away, forming a semicircular sputtering shape near the spot. When the material absorbs a larger laser energy input per unit time, most of the molten droplets cannot leave the ablation bath, forming a thicker recast layer and blocky buildup in the ablation bath.
关键词
纳秒激光 /
SiCf/SiC复合材料 /
形貌特征 /
去除机理
Key words
nanosecond laser /
SiCf/SiC composites /
morphological characteristics /
removal mechanism
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基金
辽宁省应用基础研究计划（2022020441-JH2/1013）
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