典型光学硬脆材料的原子级抛光技术发展现状

田英豪; 张振宇; 赵枫; 彭凯; 于志斌

doi:10.16490/j.cnki.issn.1001-3660.2025.23.001

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表面技术 ›› 2025, Vol. 54 ›› Issue (23) : 1-33. DOI: 10.16490/j.cnki.issn.1001-3660.2025.23.001

专题—原子级制造

典型光学硬脆材料的原子级抛光技术发展现状

田英豪¹, 张振宇^1,*, 赵枫¹, 彭凯², 于志斌¹

作者信息 +

Current Development Status of Atomic-level Polishing Technologies for Typical Optical Hard-brittle Materials

TIAN Yinghao¹, ZHANG Zhenyu, PENG Kai², YU Zhibin¹

Author information +

文章历史 +

摘要

随着精密制造技术的发展,光学系统对器件表面质量提出原子级精度要求。典型光学硬脆材料具有硬度高、塑性低及脆性断裂特征,在获得粗糙度低于0.2  nm的原子级光滑表面过程中面临诸多挑战。基于此,系统综述晶体材料（如单晶硅、蓝宝石）与非晶材料（如熔融石英）在加工响应及去除机制方面的差异,梳理化学机械抛光（CMP）、离子束抛光（IBP）、磁流变加工（MRF）、等离子体辅助原子迁移（PAMM）等代表性技术路径。针对单晶硅和蓝宝石,探讨了CMP浆料优化、晶面差异响应、超声辅助等精度提升方法。针对非晶材料熔融石英,归纳了绿色浆料、核壳磨料、多能场辅助及技术联用路径,并对比了多项原子级抛光技术的特点。除粗糙度指标外,还总结了亚表面损伤控制的形成机制和抑制策略,分析了原子级抛光技术在微裂纹抑制和缺陷最小化方面的潜力。最后展望了构建统一去除模型、开发绿色抛光体系、强化能场机制研究及集成多技术联用等未来发展方向,以支撑原子级制造向高效、绿色、智能演进。

Abstract

With the ongoing advancements in high-end manufacturing, including high-power lasers, precision optical systems, integrated circuits, and advanced semiconductor devices, the demand for ultra-smooth surfaces in optical components has reached unprecedented levels. In precision optics, the pursuit of atomically smooth surfaces with roughness below 0.2 nm has become a critical benchmark for system performance enhancement. However, typical optical hard-brittle materials face substantial challenges in achieving such surface quality due to their high hardness, low plasticity, and limited fracture toughness. These materials, which include crystalline materials like single-crystal silicon and sapphire, and amorphous materials such as fused silica, vary significantly in structure and removal response, necessitating differentiated approaches for atomic-level polishing.
This review systematically summarizes recent research on atomic-level polishing technologies for optical hard-brittle materials. The progress is categorized according to material type and the distinct mechanisms and responses observed in crystalline and amorphous systems are discussed. Key atomic-level polishing techniques covered include Chemical Mechanical Polishing (CMP), Ion Beam Polishing (IBP), Magnetorheological Finishing (MRF), and Plasma-Induced Atom-Migration Manufacturing (PAMM). Among these, CMP remains the most widely applied technique due to its synergistic mechanism of chemical reaction and mechanical removal, which offers a balance between low surface roughness and minimal subsurface damage.
For single-crystal silicon, studies have focused on abrasive design, CMP slurry composition, process parameter optimization, contamination control, and micro-removal mechanism modeling. For sapphire, known for its pronounced crystallographic anisotropy, different polishing strategies have been developed based on crystal orientations, especially for the C-, R-, and M-planes. Studies have demonstrated the effectiveness of using complexing agents, pH modifiers, ultrasonic assistance, and plasma enhancement to improve surface quality. In addition, sustainable CMP strategies involving biodegradable additives and low-toxicity formulations have shown promise in reducing environmental impact. Fused silica, as a typical amorphous hard-brittle material, exhibits uniformity in structure but high sensitivity to crack propagation. Research in this area has addressed issues through slurry system refinement, core-shell abrasive design, green polishing formulations, and the integration of energy-assisted approaches. The combination of CMP with IBP or PAMM has proven effective in reducing surface roughness while maintaining low material damage. Beyond roughness metrics, the review emphasizes subsurface damage (SSD) as a key indicator of polishing quality. Mechanistic studies reveal that techniques like CMP and PAMM can inhibit crack growth and reduce defect accumulation during processing, enabling the formation of atomically smooth and structurally intact surfaces.
Overall, atomic-level polishing of optical hard-brittle materials is evolving toward synergistic multi-process integration and energy-assisted techniques. CMP retains a dominant role due to its adaptability and mature process control, particularly in difficult-to-machine materials like sapphire. Nonetheless, it is constrained by low material removal rates and the use of aggressive chemicals. Future research directions prioritize the development of green, high-performance polishing systems with biodegradable and low-toxicity components, as well as the integration of auxiliary energy fields such as ultrasound, photocatalysis, and micro/nanobubbles to enhance interfacial reaction kinetics and stability. Meanwhile, the growing complexity introduced by multi-field systems necessitates the establishment of unified removal models and dynamic control strategies. Integration of CMP with other high-precision techniques like PAMM and IBF presents a promising path toward multi-scale, low-damage polishing routes. These combined approaches are expected to support the realization of intelligent, highly integrated atomic-scale manufacturing frameworks that meet the stringent demands of next-generation optical and electronic applications.

导出引用

田英豪, 张振宇, 赵枫, 彭凯, 于志斌. 典型光学硬脆材料的原子级抛光技术发展现状[J]. 表面技术. 2025, 54(23): 1-33 https://doi.org/10.16490/j.cnki.issn.1001-3660.2025.23.001

TIAN Yinghao, ZHANG Zhenyu, PENG Kai, YU Zhibin. Current Development Status of Atomic-level Polishing Technologies for Typical Optical Hard-brittle Materials[J]. Surface Technology. 2025, 54(23): 1-33 https://doi.org/10.16490/j.cnki.issn.1001-3660.2025.23.001

中图分类号： TN305.2

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