合金共沉积多尺度机理与功能镀层调控进展

贺颖; 徐子暄; 丁运虎; 张天遂; 李广芳; 刘宏芳

doi:10.16490/j.cnki.issn.1001-3660.2025.13.002

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表面技术 ›› 2025, Vol. 54 ›› Issue (13) : 16-28. DOI: 10.16490/j.cnki.issn.1001-3660.2025.13.002

研究综述

合金共沉积多尺度机理与功能镀层调控进展

贺颖^1,2, 徐子暄¹, 丁运虎^1,2, 张天遂¹, 李广芳¹, 刘宏芳^1*

作者信息 +

Multiscale Mechanisms and Functional Coating Regulation Advances of Alloy Co-deposition

HE Ying^1,2, XU Zixuan¹, DING Yunhu^1,2, ZHANG Tiansui¹, LI Guangfang¹, LIU Hongfang^1*

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文章历史 +

摘要

合金共沉积技术是一种涉及多种金属离子同步沉积的先进材料制备方法,具有设备简单、工艺灵活、沉积效率高及可实现特定功能特性等优势,应用场景从传统的汽车、航空航天领域,逐渐扩展至生物医学、能源和微电子等新兴前沿领域。基于精确控制合金的成分、结构和性能以提高材料性能的迫切需要,深刻理解合金共沉积的机理显得至关重要。全面梳理了合金共沉积技术的最新研究进展,着重从传统电化学理论和量子力学理论2个维度探讨合金共沉积过程中金属离子的宏观动力学特性和微观沉积行为,并基于上述理论模型进一步阐述溶液成分、溶液浓度、电沉积参数、基底材料及外部刺激等关键因素影响沉积过程的方式,揭示合金镀层性能优化的关键调控机制,并探讨合金共沉积技术及其变体或拓展技术在能源存储与转换、先进微电子器件及材料保护等领域的应用实例。最后,对合金共沉积技术的未来发展进行展望,指出计算模拟与实验相结合的研究方法在合金材料设计和性能优化中发挥着关键作用,开发环境友好型合金共沉积工艺在推动绿色经济中具有潜在价值。

Abstract

Alloy co-deposition technology, serving as an advanced method of material preparation by concurrently depositing multiple metal ions, has gained wide recognition due to its straightforward equipment requirements, adaptable process, and remarkable deposition efficiency, as well as its capacity to confer specific functional attributes. Originally circumscribed to conventional domains including automotive, aerospace, its application scope has been progressively expanded into emerging fields exemplified by biomedicine, energy, and microelectronics. In light of the imperative and urgent demand for precisely manipulating the composition, structure, and properties of alloys with the aim of augmenting material performance, a profound comprehension of the underlying mechanisms governing alloy co-deposition has emerged as a matter of paramount importance. This comprehensive review undertakes a meticulous dissection of the alloy co-deposition process by adopting a dual-faceted approach integrating conventional electrochemical theory and quantum mechanics. From the vantage point of electrochemistry, it delves into the deposition process as a series of precisely delineated steps, including metal ion transportation, interfacial charge transference, and the subsequent nucleation and growth of alloy phases. It is noteworthy that appropriate metal ion ratios and additive concentrations play a facilitating role in alloy co-deposition and contribute to the formation of smooth coating morphologies. Cathodic current density exerts an influence on the electrocrystallization mode and the grain size of the coating within a certain range. Moreover, pH value can modify the solvation state and the reduction potential of metal ions, while temperature affects the activity and solubility of each component and mass transfer. These factors interact complexly and are crucial in optimizing the deposition process. Special emphasis is placed on the anomalous co-deposition behaviors between iron group metals, as well as between them and Zn, Cd or Sn, which often deviate from the expected deposition patterns. Quantum mechanics provides an atomic-scale perspective that augments our comprehension of the manner in which the electronic structure, encapsulated by concepts such as Fermi energy levels and energy band structure, impacts the reduction potential and the adsorption of metal ions at the cathode surface. Through the integration of these theoretical frameworks, a systematic scrutiny is conducted on the influence exerted by solution composition, concentration, electrodeposition parameters, substrate materials, and external factors on the deposition process, thereby unearthing crucial regulatory mechanisms conducive to augmenting alloy plating performance. In addition, this review expounds upon the application of co-deposition technology as well as its variants and extensions in the fields of energy storage and conversion, advanced microelectronic devices, and materials protection, including pulsed electroplating, electroless plating, electrochemical atomic layer deposition, laser-assisted electrodeposition, electrodeposition-redox replacement technology, electrochemical additive manufacturing, and electrochemical stripping technology, thereby attesting to the versatility and latent potential of this technique in fabricating high-performance materials. It highlights the key role played by the synergy between computational simulations and experimental methods, which is essential for the design and optimization of alloy materials. Looking ahead, it ardently advocates for the innovation and development of environmentally friendly co-deposition processes in harmony with the global transition towards sustainability. Such processes, minimizing environmental footprint while boosting material performance, present substantial opportunities for forthcoming research and industrial adoption.

导出引用

贺颖, 徐子暄, 丁运虎, 张天遂, 李广芳, 刘宏芳. 合金共沉积多尺度机理与功能镀层调控进展[J]. 表面技术. 2025, 54(13): 16-28 https://doi.org/10.16490/j.cnki.issn.1001-3660.2025.13.002

HE Ying, XU Zixuan, DING Yunhu, ZHANG Tiansui, LI Guangfang, LIU Hongfang. Multiscale Mechanisms and Functional Coating Regulation Advances of Alloy Co-deposition[J]. Surface Technology. 2025, 54(13): 16-28 https://doi.org/10.16490/j.cnki.issn.1001-3660.2025.13.002

中图分类号： TQ153 TB33

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