目的 涂层剥离涉及大位移大变形问题。为了更好地模拟涂层剥离过程，提出了内聚力界面-离散化虚内键(DVIB)方法。通过数值模拟，研究了涂层和界面特性以及界面裂纹对涂层剥离的影响。方法 在模拟中，涂层和基体之间的界面特性通过双线性黏结法则(Cohesive Law)来描述。涂层看作由离散键元胞组成，每个键元胞由有限条虚内键组成。键元胞的“节点力-位移”关系直接由键势函数(Bond Potential)导出，没有引入任何连续介质假设，因此DVIB可以直接模拟涂层大位移和大变形问题。结果 采用该方法对不同条件下的涂层剥离进行数值模拟，分析不同条件对涂层剥离的影响。涂层厚度和模量影响稳定阶段之前的剥离力，涂层黏附能影响整个过程剥离力。涂层厚度、模量和界面黏附能都与涂层剥离力呈正相关;涂层与基体之间的端部裂纹会使涂层峰值剥离力减小;内部裂纹长度和位置均会对剥离力产生不同的影响。当黏结强度和界面黏附能一定时，黏结法则的几何形状只会影响剥离力的峰前段，对剥离力的峰值和峰后阶段几乎没有影响。结论 本研究为涂层剥离提供了一种新的模拟方法，研究结果为涂层剥离分析提供有意义的借鉴。

As a barrier structure, the coating plays important roles to prevent the material from damage, corrosion, etc. However, the way to effectively model and simulate the coating peeling behaviors is still a tough but important problem since it involves large deformation and large displacement. Moreover, the coating peeling mechanism and its influence factors are still not well understood. To better simulate and get a deeper insight into the coating peeling behaviors, the cohesive interface-discretized virtual internal bond method (DVIB) is developed in this paper. Through the numerical simulation, the impact of the coating properties, the interface properties, the interface crack and the shape of cohesive law on the coating peeling behaviors are studied in detail. The coating/substrate system consists of three components:the coating, the interface, and the substrate. In the present method, the adhesion of the coating to the substrate is characterized by a bilinear cohesive law based on the hypothesis of a smooth substrate surface. For the rough substrate surface case, equivalent adhesion energy for the coating is proposed to deal with this problem. The coating is considered to consist of bond cells. Each bond cell has a finite number of bonds. The nodal force-displacement relation of a bond cell is directly derived by a bond potential, without any continuous hypothesis. Thus, DVIB can directly simulate the large deformation and large displacement behaviors of the coating. Through this method, the coating peeling processes under different conditions are simulated and the influence factors on the peeling behaviors are analyzed. The thickness, modulus, and interfacial adhesion energy of the coating significantly affect the peeling force and the damage zone length. The coating modulus mainly affects the peak peeling force rather than the steady one. The higher the modulus is, the higher the peak peeling force. The thickness of the coating has a similar effect on the peeling force. This is because both the higher modulus and the thickness can lead to a stronger bending resistance of the coating. In contrast to the modulus and the thickness, the interfacial adhesion energy governs more the steady peeling force although it also affects the peak peeling force. Higher adhesion energy leads to a higher peeling force. During the peeling process, the damage zone length is related to the thickness, modulus, and interfacial adhesion energy of the coating. The higher thickness, modulus and interfacial adhesion energy lead to a longer damage zone. The end interface crack affects the peak peeling force. The longer the end interface crack is, the lower the peak peeling force. But the peak peeling force is not lower than its steady value. The position and the length of an inner interface crack mainly affect the peeling behaviors at the pre-steady peeling stage. As the cohesive strength and adhesion energy of the interface are fixed, the specific geometrical shape of the cohesive law has effects on the peeling force at the pre-peak stage. A higher pre-peak ‘stiffness‘ of the cohesive law results in a steeper pre-peak peeling force curve. But the shape of cohesive law has little effects on the peak peeling force and no effect on the post-peak peeling force. The present study provides a novel numerical simulation method for coating peeling behaviors and reveals the influence factors on the coating peeling behaviors. The study results provide valuable references for coating peeling analysis.