铜作为一种导热率高、导电性能良好且价格相对低廉的金属，是制作电子元器件电极的理想材料。但铜微电极容易被氧化，与其他制备铜电极方法相比，激光直写技术能在其制作过程中较大程度地降低被还原出来的铜电极中的氧含量。目前激光直写铜微电极主要采用激光辐照油墨，致使油墨中的还原剂发生热分解从而还原出铜纳米颗粒，并烧结在一起形成铜电极。首先介绍了国内外激光直写铜微电极的现状，对基于油墨材料激光直写铜微电极的工艺步骤进行了简单概述。主要归纳了激光直写铜电极所采取的油墨材料(三水硝酸铜油墨、氧化铜纳米油墨和其他油墨)及其制备方法，分析了不同油墨材料经过激光辐照后还原铜纳米颗粒的机理以及影响导电性能的因素。影响铜微电极导电性能的因素有激光工艺参数(功率、扫描速度、脉宽、模式)、涂层厚度、涂层干燥时间、还原剂的物质的量比。然后对基底材料的选择(玻璃、聚对苯二甲酸乙二醇酯、聚碳酸酯、聚酰亚胺、聚萘二甲酸乙二醇酯)及激光直写铜微电极的应用进行了概述。最后进行了总结以及对未来进行展望。

With the rapid development of information technology and the rise of the consumer electronic markets, portable flexible electronic devices such as sensors, planar antennas and displays have attracted widespread attentions. Several metals with excellent conductivity and electrochemical activity, including Au, Ag and Cu, have a wide range of applications in the fabrication of these devices. As a kind of metal with high thermal conductivity, outstanding electrical conductivity and relatively low price, copper is an ideal material for making electrodes of electronic components. However, copper electrodes are prone to be oxidized. Compared with other methods of preparing copper microelectrodes, laser direct writing technology has the characteristics of superior efficiency, high precision, and fast sintering speed, thus significantly decreasing the oxygen content of the reduced copper electrodes in the manufacturing process and simplifying the process steps. At present, laser direct writing of copper microelectrodes refers to using laser to irradiate ink, resulting in the thermal decomposition of the reducing agents dissolved in the ink which are sintered together to form a copper electrode.