金镀层具有良好的耐腐蚀性、抗氧化性、导电性及延展性，广泛应用于精密微纳元器件制造。电化学镀金是实现微纳元器件镀金的主要工艺之一，主要分为直流镀金工艺和脉冲镀金工艺。相较于直流镀金工艺，脉冲镀金工艺可通过控制脉冲波形、频率、占空比及电流密度等脉冲参数，改变金属离子电沉积过程中的电化学极化和浓差极化，灵活调控镀层的物理化学性能。近年来，国内外在微纳元器件脉冲镀金工艺领域开展了系列研究工作，并取得了不错的进展。综述了电化学脉冲镀金的基本原理，描述了电镀金试验中金由离子形态转化为金属的过程。此外，还综述了占空比、频率、电流密度、脉冲导通时间、脉冲关断时间等脉冲参数对金镀层形成的影响，以及镀层性能评价方式;另外，介绍了无氰和有氰两大典型镀液获得金镀层的基本情况，分析了它们各自的优缺点，主要表现为有氰镀液稳定性好，所得金镀层较均匀，而无氰镀液的突出优势为无毒，但其稳定性有待进一步提高。最后，展望了脉冲镀金工艺的发展方向，可为发展新型脉冲镀金工艺及应用拓展提供有益的参考和启示。

As a precious metal, gold has stable physical and chemical properties and wide range of applications in industrial and military fields. Therefore, the gold plating layer has good corrosion resistance, oxidation resistance, electrical conductivity and ductility, which is widely used in the manufacturing of precision micro- and nano-components. At present, electrochemical plating is one of the main processes for the realization of gold plating on micro- and nano- components. On the basis of potential or current applying mode, the electrochemical plating can be mainly divided into direct current plating process and pulse plating process. Compared with the direct current plating process, pulse plating process can regulate the electrochemical and concentration polarization of metal ions during electrodeposition process by controlling several pulse parameters, such as pulse waveform, frequency, duty cycle and current density. As a result, the physical and chemical properties of gold plating layer on micro- and nano-components can be flexibly adjusted during the pulse plating process.