目的 探究IC10单晶高温合金缓进磨削表面完整性的影响因素，提高关键零件的使用性能。方法 通过制备不同晶面、同一晶面不同晶向试块，采用刚玉砂轮在同一工艺参数下开展缓进磨削实验，研究各向异性对工件表面粗糙度、表面形貌、显微硬度和塑性变形层的影响。结果 在vs = 20 m/s，vw = 150 mm/min，ap = 0.2 mm条件下，不同晶面磨削后的平均表面粗糙度Ra为0.3~0.4 μm，其中(001)晶面加工后的平均表面粗糙度Ra为0.32 μm，加工纹理均匀且轮廓起伏变化程度最小，(011)晶面的平均表面粗糙度Ra为0.35 μm，(111)晶面的平均表面粗糙度Ra为0.39 μm，其表面出现了深的犁沟及凹坑等现象;不同晶面加工后工件表面均发生了硬化，硬化程度由强到弱依次为(001)、(011)、(111)晶面;不同晶面磨削后表面存在微米级厚度的塑性变形层，其中(111)晶面塑性变形层最厚，厚度为3.6 μm，(011)和(001)晶面的厚度分别为2.8、2 μm。(001)晶面在不同晶向磨削后工件的表面粗糙度、表面形貌、显微硬度和塑性变形层则无明显的规律性变化。结论 IC10单晶高温合金各向异性对磨削后工件表面完整性具有一定影响，不同晶面由于塑性变形难度存在差异，导致磨削后其表面完整性存在规律性变化，其中(001)晶面加工后的表面粗糙度最低，加工纹理最平整，显微硬度最大，塑性变形层厚度最小。由于显微组织呈现随机分布的圆形、方形、三角形等形态，且不规则，导致同一晶面不同晶向对磨削后工件表面完整性的影响无明显规律。

IC10 superalloy has been used to manufacture turbine blades of high thrust-to-weight ratio aero-engine due to its excellent properties such as small specific gravity, high strength and creep resistance under high-temperature environment. Creep feed grinding which has the characteristics of high efficiency and high precision is applied for precision machining after blade casting. Surface integrity after processing has an important impact on the fatigue life and service performance of the parts. Owing to the difficult-to-machine characteristics of superalloy, it is difficult to ensure the surface integrity of the workpiece after grinding. Specifically, surface integrity of single crystal superalloy is affected not only by the grinding process parameters, but also by anisotropy. Therefore, the work aims to systematically study the effect of the anisotropy of IC10 single crystal superalloy on the surface roughness, surface morphology, microhardness and plastic deformation layer after grinding and explore its engineering application. The sticks of IC10 single crystal superalloy were poured by the spiral crystal selection method and the directional solidification process. The stick of which growth direction from the [001] crystal orientation was 4.9° was selected (generally considered to be qualified within 8°), and then subject to solid solution process and the aging treatment. The workpieces with three typical crystal planes (001), (011) and (111) were cut by wire cutting, and the (001) crystal plane was selected to make metallographic samples to determine [100] and [010] crystal orientation according to dendrite direction. The workpieces with different crystal orientations were cut along the [100] crystal orientation every 15°. All workpieces were cut into 20 mm×10 mm×15 mm cuboid. Before the experiment, the surface of the workpieces was finely ground to remove the remelted layer caused by the wire cutting to ensure that workpieces were consistent. Creep feed grinding experiments were carried out along different crystal planes and different crystal directions under the same process parameter (grinding wheel linear speed of 20 m/s, workpiece feed speed of 150 mm/min, and grinding depth of 0.2 mm). The experimental equipment was a three-axis creep feed grinder (Chevalier FSG-B818CNC), the coolant was an emulsion (Basso) with a concentration of 3wt.%, and the grinding wheel was mixed abrasive grinding wheel with white corundum and chromium corundum (Norton WA/PA80-F25VCF2). The surface profiler (Talysurf CLI2000) was used to measure the surface roughness of the workpiece after grinding and the laser confocal microscope (OLYMPUS OLS5000) and the scanning electron microscope (ZEISS Sigma 300) were used to observe the surface morphology. The micro Vickers hardness tester (Qness) was used to test the microhardness, and the scanning electron microscope was used to observe the plastic deformation layer. The surface roughness Ra of different crystal planes after grinding was between 0.3-0.4 μm. The surface roughness Ra of (001) crystal plane after processing was 0.32 μm. The surface processing texture was uniform and the degree of contour fluctuation was minimal. The surface roughness Ra of (011) crystal surface after processing was 0.35 μm. The surface roughness Ra of (111) crystal plane after grinding was 0.39 μm, and deep furrows and pits appeared on the surface of the workpiece. The surface of different crystal planes hardened after processing, and the degree of hardening was (001), (011) and (111) from strong to weak. There was plastic deformation layer with micron-sized thickness under the grinding surface. The (111) crystal plane had the thickest plastic deformation layer at 3.6 μm, and the thickness of (011) and (001) crystal planes were respectively 2.8 μm and 2 μm. The surface roughness, surface morphology, microhardness and plastic deformation layer of (001) crystal plane with different crystal orientations after grinding did not show obvious regular changes. The anisotropy of IC10 single crystal superalloy has a certain effect on the surface integrity of workpiece after grinding. The surface integrity of different crystal planes after grinding changes regularly due to difference in plastic deformation of different crystal planes. The surface roughness of (001) crystal plane is the lowest after processing, the surface processing texture is the smoothest, the microhardness is the largest, and the thickness of plastic deformation layer is the smallest. However, the status of microstructure is randomly distributed such as circles, squares, triangles, etc., which results in no obvious regularity for the surface integrity of workpiece with different crystal orientations on the same crystal plane.