目的 研究纯铜在含氯液膜和霉菌共同作用下的腐蚀行为与机理。方法 将海南文昌采集的一株野生杂色曲霉接种到质量分数分别为0.9%和3.5%的NaCl溶液中制成孢子悬浮液，将孢子悬浮液均匀喷洒到铜试样表面后进行恒温恒湿试验，试验不同周期后采用体视学显微镜、扫描电子显微镜观察铜试样的腐蚀形貌，采用X射线光电子能谱仪分析试验14 d的试样表面和氩离子刻蚀15 s后的成分。结果 纯铜在NaCl薄液膜下的腐蚀产物具有明显的双层结构，内层靠近基体的为致密的Cu2O钝化层，外层为疏松的Cu2(OH)2CO3和Cu2(OH)3Cl组成的Cu(II)碱式盐;无菌时，铜表面出现大量蓝绿色的Cu(II)碱式盐，杂色曲霉存在时，铜表面腐蚀产物主要为红棕色的Cu2O钝化膜，仅有少量Cu(II)碱式盐零星分布在Cu2O膜外层;0.9% NaCl薄液膜与霉菌共同作用时，试样表面腐蚀产物主要为Cu2O，当薄液膜中盐的质量分数升高到3.5%时，霉菌数量减少，Cu(II)碱式盐较0.9% NaCl薄液膜组增多。结论 纯铜的腐蚀产物由内层的Cu2O钝化层、外层的Cu2(OH)2CO3和Cu2(OH)3Cl组成双层结构。杂色曲霉通过呼吸作用影响液膜中的O2浓度进而影响铜的腐蚀产物组成，霉菌存在时腐蚀产物中Cu(II)碱式盐显著减少。含氯液膜与霉菌共同作用时，液膜中的NaCl浓度通过影响杂色曲霉的生长活性而影响腐蚀产物组成。

Copper is the main material of electronic components, but it is prone to be corroded in the atmospheric environment, especially in the marine atmospheric environment with high humidity and high salinity, which would result in the failure of electronic and electrical devices. When mold grows on the surface of electronic components in the humid environment, the corrosion of cooper becomes more complex, and their coupling mechanism is not clear yet. To study the corrosion behaviour of copper under the action of chloride-containing thin liquid film and molds, a dominant fungus, Aspergillus versicolor, collected in Wenchang, Hainan province was included into solutions containing NaCl with concentration of 0.9wt.% and 3.5wt.% respectively to prepare spore suspensions. Then spore suspensions of different NaCl concentration were evenly sprayed on the surface of copper samples for corrosion tests of constant temperature and humidity. After corrosion tests, the surface of samples was observed by stereological microscope and scanning electron microscope, and corrosion products compositions on the samples surface and inner layer after etching for 15 seconds by argon ion were analyzed by X-ray photoelectron spectroscopy. It was found that copper samples were severely corroded under the thin liquid film containing chloride ions. As the concentration of NaCl in thin liquid film increased from 0.9wt.% to 3.5wt.%, the corrosion products increases significantly and its thickness becomes much larger. It can be found that samples surface and inner layer corrosion products of copper under chloride-containing thin liquid film had a double-layers structure. The inner corrosion products layer closed to the matrix was dense passive film of Cu2O, and the outer corrosion products layer were loose Cu (II) basic salts composed with Cu2(OH)2CO3 and Cu2(OH)3Cl. The corrosion behavior of copper was quite different with or without Aspergillus versicolor. A large number of blue-green Cu (II) basic salts appeared on the surface of sterile samples, while the corrosion products in the presence of Aspergillus versicolor was mainly Cu2O and only a small amount of Cu (II) basic salts were sporadically distributed in the outer layer of Cu2O film. When molds and Chloride ions exist simultaneously, the composition of corrosion products was influenced by the growth activity of molds that was affected by the concentration of NaCl in thin liquid film. Under the simultaneous action of thin liquid film of 0.9wt.% NaCl and fungi, the corrosion products were mainly Cu2O, when the concentration of NaCl in thin liquid film increased to 3.5wt.%, the number of fungi decreased, and Cu (II) basic salts increased compared with 0.9wt.%NaCl experiment group. The results showed that the corrosion products of copper had a double-layers structure with inner Cu2O passive film and outer Cu (II) basic salts, and Aspergillus versicolor affected the concentration of O2 in thin liquid films through respiration, and the affected the type of corrosion products. In the presence of Aspergillus versicolor, Cu (II) basic salts decreased significantly. When the chlorine-containing liquid film is coupled with fungi, the NaCl concentration of the liquid film affected the type of corrosion products by affecting the growth activity of Aspergillus variegatus.