目的 提高SS316L双极板的耐腐蚀性与导电性。方法 使用脉冲直流磁控溅射技术，改变基体负偏压，于SS316L双极板上制备了Cr-N薄膜。通过扫描电子显微镜、XRD衍射仪、电子探针分析仪对薄膜的成分和结构进行了检测分析。通过接触电阻测试、电化学腐蚀测试和接触角测试表征了薄膜的导电性、耐腐蚀性和疏水性。结果 薄膜的结构主要由Cr和Cr2N组成，各组试样的成分相近。随着沉积过程中基体负偏压的增大，薄膜结构更加致密。镀膜试样的耐腐蚀性均好于基材SS316L，基体负偏压为400 V时，测得试样的腐蚀电流密度最低，为3.49×10^?7 A/cm²。镀膜试样的导电性均好于基材SS316L，基体为负偏压200 V时，双极板的导电性最好，表面接触电阻为8.02 mΩ.cm²。基体负偏压继续增大，双极板的接触电阻会有所下降。结论 随着沉积偏压的增加，薄膜中的N含量略有增加。薄膜沉积对SS316L双极板的导电性、耐腐蚀性和疏水性有明显的提高，较于基材自腐蚀电位提升了411 mV，腐蚀电流密度下降了2个数量级。沉积时较高的基体负偏压对于双极板的导电性和耐腐蚀性提升更显著。但过高的基体负偏压导致薄膜的晶粒细小，致密性好，对薄膜的导电性会有所影响。

In order to improve the corrosion resistance and conductivity of SS316L bipolar plate. Cr-N thin films were prepared on SS316L bipolar plates by pulsed DC magnetron sputtering. The composition and structure of the film were detected and analyzed by scanning electron microscope, XRD diffractometer and electron probe analyzer. The conductivity, corrosion resistance and hydrophobicity of the films were characterized by contact resistance test, electrochemical corrosion test and contact angle test. The structure of the film was mainly composed of Cr and Cr2N, and the composition of each group of samples was similar. With the increase of substrate negative bias during deposition, the structure of the film became more compact. The corrosion resistance of the coated sample was better than that of the substrate SS316L. When the negative bias voltage of the substrate is 400 V, the corrosion current density of the sample was the lowest, which was 3.49×10?7 A/cm2; The conductivity of coated samples was better than that of substrate SS316L. When the substrate was negative bias voltage of 200 V, the conductivity of bipolar plate was the best, and the surface contact resistance was 8.02 mΩ.cm2. If the substrate negative bias voltage continues to increase, the contact resistance of bipolar plate will decrease. With the increase of deposition bias, the content of N in the film increases slightly. The deposition of the film significantly improved the conductivity, corrosion resistance and hydrophobicity of SS316L bipolar plate. Compared with the substrate, the self corrosion potential increased by 411 mV and the corrosion current density decreased by two orders of magnitude. The higher substrate negative bias during deposition was more significant for the improvement of the conductivity and corrosion resistance of the bipolar plate, but the higher substrate negative bias leads to the fine grains and good compactness of the film, which will affect the electrical conductivity of the film.