目的 研究不同强度恒定磁场下杂色曲霉对PCB-Cu的腐蚀行为与机理。方法 对PCB-Cu试样表面喷涂孢子悬浮液，沿垂直于试样表面方向分别施加不同恒定强度的磁场。采用3D共聚焦显微镜、扫描电子显微镜(SEM)、能谱分析仪(EDS)、拉曼光谱仪，研究杂色曲霉的生长状况，分析表面腐蚀形态和产物组成。采用扫描开尔文探针(SKP)测试分析PCB-Cu上的表面电势变化。结果 通过观察表面形貌可以明显看出，无磁场组霉菌生命活动更旺盛，并且磁场强度越高，对霉菌生长的抑制作用越强，这使得霉菌孢子数量减少、生长状况变差。磁场影响霉菌生长和腐蚀性离子的迁移，在恒定强度为15 mT时，出现腐蚀拐点。通过对腐蚀产物的成分进行测定，表明腐蚀产物成分存在不同，无磁场区比磁场区的O、Cl含量更高。结论 磁场主要通过影响霉菌生长对PCB-Cu的腐蚀起到抑制作用，但是磁场也会影响离子的迁移，进而加速电化学腐蚀，在磁场强度为15 mT时，腐蚀程度最轻微。无磁场的腐蚀产物主要由CuO、少量的Cu2O和铜的氯化物组成，施加磁场后，CuO和铜的氯化物成为主要腐蚀产物。

This study investigated the corrosion behavior and mechanism of aspergillus versicolor on PCB-Cu under constant magnetic fields of different strengths. The surfaces of the PCB-Cu samples were sprayed with a spore suspension, and magnetic fields of different constant strength were applied along the direction perpendicular to the surface of the sample. The growth of aspergillus versicolor and the corrosion behavior of PCB surface were studied by using 3D confocal microscope, scanning electron microscope (SEM), energy spectrum analysis (EDS), and Raman spectroscopy. The potential change on the PCB-Cu surfaces were characterized by scanning Kelvin probe (SKP). By observing the surface morphology of the mold, it could be clearly seen that the molds in the non-magnetic field group had more vigorous life activities, and the higher the magnetic field strength, the stronger the inhibitory effect on mold growth, which reduced the number of mold spores and deteriorated the growth status. The magnetic field affects the growth of mold and the migration of corrosive ions, and the corrosion inflection point appears when the strength is 15 mT. The composition of the corrosion products were different, where the content of O and Cl in the non-magnetic field were higher than that in the magnetic field. The magnetic field mainly inhibits the corrosion of PCB-Cu by affecting the growth of mold, but the magnetic field also affects the migration of ions to accelerate the electrochemical corrosion. Therefore, when the magnetic field strength is 15 mT, the degree of corrosion is minimal. The corrosion products without magnetic field are mainly composed of CuO, a small amount of Cu2O and copper chlorides, but CuO and copper chlorides become the main corrosion products after applying a magnetic field.