高熵合金是一种由五种或者五种以上的元素以(近)等原子比组成的新型多主元合金材料，拥有众多优异的力学、物理和电学方面的性能，引起了科技工作者的极大关注。高熵合金薄膜是一种低维度形态(微米级)的高熵合金材料，不仅展现出与块体高熵合金相似的优异性能，而且在某些性能(如硬度)上甚至优于块体高熵合金，在诸多领域里展现出良好的应用前景。从高熵合金的设计理念出发，简述了高熵合金薄膜材料的发展历程和主要分类，介绍了近年来高熵合金薄膜的主要制备方法，并论述了这些方法的原理及其优缺点。阐述了高熵合金薄膜材料具有简单晶体结构的原因以及影响晶体结构的主要因素。重点描述了高熵合金薄膜的力学性能、摩擦磨损性能、耐高温和抗氧化性能以及耐腐蚀性能的特点及研究进展，总结了高熵合金薄膜拥有众多优异性能的原因和影响因素。表明了高熵合金薄膜材料在耐热、耐磨、耐蚀等涂层领域的潜在应用，并对未来高熵合金薄膜在计算模拟、相形成规律等方面以及在特殊条件下使用的薄膜材料的研发方面进行了展望。

High-entropy alloy is an emerging multi-component alloy material composed of five or more elements with (near) equal atomic ratio, which has attracted great attention of scientific workers due to many excellent mechanical, physical and electrical properties. High-entropy alloy thin film is a kind of low-dimensional (micron scale) high-entropy alloy material, which not only exhibits the similar excellent properties of bulk high-entropy alloy, but also is even better than bulk alloy in some properties (such as hardness), showing a good application prospect in many fields. Starting from the design concept of high-entropy alloy, the development process and main classification of high-entropy alloy thin film material were firstly reviewed. Then the main preparation methods of high-entropy alloy thin film in recent years as well as the the principles, advantages and disadvantages of these methods were introduced. The reasons for the simple crystal structures of high-entropy alloy thin film material and the main important factors affecting the crystal structures were also elaborated. Moreover, the characteristics and research progress of the mechanical properties, tribological properties, high temperature resistance, oxidation resistance and corrosion resistance of the high entropy alloy film were described in detail. The reasons and affecting factors for the excellent properties of high-entropy alloy film were summarized. The potential applications of the high-entropy alloy films in the fields of heat resistance, wear resistance and corrosion resistance were also presented. On this basis, some development directions, such as computational simulation, formation laws of phases and thin films under special conditions, were put forward for the future development of these thin films.