目的 利用真空镀膜技术对铁氧体电磁感芯表面进行金属化处理，对金属薄膜的结构及性能进行综合分析，为其实现工程应用提供一定的理论基础。方法 采用多腔一体式磁控溅射设备在铁氧体磁体表面依次沉积Cr、Ni、Ag，作为铁氧体表面复合金属薄膜。采用扫描电镜对复合薄膜表面、截面形貌进行表征；利用原子力显微镜对复合薄膜表面粗糙度进行测量；利用划格法对复合薄膜附着力进行测试；利用冲压试验对复合薄膜剥离强度进行测试；利用拉伸试验对复合薄膜结合强度进行测试；利用浸锡试验对复合薄膜耐焊性进行测试。结果 试验制备的Cr/Ni/Ag复合薄膜各层厚度分别为420、4200、550 nm，Cr层与Ni层有明显柱状晶结构，层间界面清晰、无明显孔隙，Ag层与Ni层紧密结合。复合薄膜表面粗糙度为13 nm，附着力达0B级，结合力为30 N，抗拉强度达42 MPa。复合薄膜经过450 ℃浸锡18 s后，表面金属薄膜无脱焊或露底。结论 采用磁控溅射技术制备的Cr(420 nm)/Ni(4200 nm)/ Ag(550 nm)复合金属薄膜结构致密均匀，综合性能优异，达到铁氧体电感磁芯表面金属薄膜技术要求。

The work aims to metallize the surface of the ferrite electromagnetic core by vacuum coating technology, and comprehensively analyze the structure and performance of the metal composite film to provide a theoretical basis for engineering application. Multi-cavity integrated magnetron sputtering equipment was used to deposit Cr, Ni and Ag on the surface of ferrite magnets as the metal composite film on ferrite. The surface and cross-section morphology of the composite film were characterized by scanning electron microscopy. The surface roughness of the composite film was measured by atomic force microscopy. The adhesion of the composite film was tested by the cross-cut method. The peel strength of the composite film was tested by stamping test. The tensile strength of the composite film was tested by tensile test. The solder resistance of the composite film was tested by immersion tin test. The thickness of Cr/Ni/Ag composite films was 420, 4200 and 550 nm respectively. Cr layer and Ni layer had obvious columnar crystals. The interface between layers was clear without obvious pores. The Ag layer was tightly combined with Ni layer. The surface roughness of composite film was 13 nm, adhesion was 0B, bonding force was 30 N and tensile strength was 49 MPa. After tin immersion for 18 s at 450 ℃, the metal film had no desoldering or exposure. The Cr(420 nm)/Ni(4200 nm)/Ag(550 nm) composite metallized film prepared by magnetron sputtering technology has compact and uniform structure and excellent comprehensive performance, which meets the technical requirements of ferrite inductor surface metallized film.