目的 改善铜在海洋环境中的耐腐蚀性能。方法 将化学刻蚀与电化学氧化成膜相结合，在金属铜表面制备超疏水结构，采用单因素实验分别考察了硬脂酸浓度、苯并三氮唑浓度、电沉积电压以及电沉积时间对所制备表面结构接触角的影响规律，通过动电位极化曲线和电化学阻抗谱研究了铜基超疏水结构在3.5% NaCl溶液中的耐蚀性能。结果 当硬脂酸浓度为0.02 mol/L，苯并三氮唑质量浓度为40 mg/L，电沉积电压为8 V，腐蚀时间为12 h时，所制备的铜基超疏水膜接触角达到了158°，滚动角为3°。动电位极化测试表明，超疏水表面同时抑制了阳极和阴极反应，经超疏水处理的铜在3.5% NaCl溶液中的自腐蚀电流密度相比未经处理时减小了约2个数量级，缓蚀效率高达99%。电化学阻抗结果表明，电荷转移电阻由1.61 kΩ?cm2增大至41.3 kΩ?cm2，铜基超疏水膜具有优异的耐蚀性能。结论 通过化学刻蚀与电化学氧化成膜可在铜表面构筑超疏水结构，使其在海洋环境下具有优异的耐蚀性能。

The work aims to improve the corrosion resistance of copper in marine environment. The superhydrophobic structure was prepared on the copper surface by chemical etching and electrochemical oxidation film formation. Single factor experiments were applied to investigate the rule of effect of stearic acid concentration, benzotriazole concentration, electrodeposition voltage and electrodeposition time on the contact angle of the prepared surface structure. The corrosion resistance of copper-based superhydrophobic structure in 3.5% NaCl solution was investigated by potentiodynamic polarization curve and electrochemical impedance spectroscopy (EIS). Results revealed that, the contact angle of the prepared copper-based superhydrophobic structure reached 158° and the sliding angle was 3° when stearic acid concentration was 0.02 mol/L, benzotriazole concentration was 40 mg/L, electrodeposition voltage was 8 V and corrosion time was 12 h. The potentiodynamic polarization test indicated that, both the anodic and cathodic reactions were restrained by the superhydrophobic surface; the self-corrosion current density of the copper in the 3.5% NaCl solution and subject to superhydrophobic treatment was decreased by two orders of magnitude, compared with the untreated copper, and the corrosion inhibition efficiency was as high as 99%. The electrochemical impedance measurements suggested that, the copper-based superhydrophobic film had excellent corrosion resistance when the charge transfer resistance increased from 1.61 kΩ?cm2 to 41.3 kΩ?cm2. Therefore, the superhydrophobic structure can be prepared on the copper surface by chemical etching and electrochemical oxidation film formation and exhibits excellent corrosion resistance in marine environment.