目的 解决微细流路芯片中微细流路制备时，传统加工工艺存在的效率低下等问题。方法 采用飞秒激光加工碳化钨模具，进行工艺研究。对扫描功率、扫描速度、扫描层数等参数进行田口正交实验，研究其变化对加工表面质量及尺寸精度的影响。使用白光干涉仪测量了加工后表面的粗糙度，使用超景深三维显微系统测量了加工深度，并通过对结果的综合优化得出了最优工艺参数。结果 在所选的25组工艺参数中，各参数的变化对表面粗糙度值影响不大，对材料加工深度影响最大的因素为扫描速度，影响最小 的为激光功率。经过综合优化，最佳工艺参数组合为：扫描功率20 W，扫描速度200 mm/s，扫描层数25。 结论 随着飞秒激光功率的增大、扫描速度的减小和扫描层数的增加，加工深度都有显著增加。以最优加工参数加工而得的模具微凸起的上表面宽度为152 μm，边缘整齐，通道深度为42.41 μm，横压成形玻璃表面粗糙度值为0.164 μm。研究结果为飞秒激光加工碳化钨微细流路提供了一定的参考。

The work aims to solve the problems of low efficiency of milling in traditional micro-groove machining process for micro-fluidic chip. The machining process for tungsten carbide die was studied by femtosecond laser. Scanning power, scanning speed and scanning layer were adopted for orthogonal test to study their influence on surface quality and size precision. Roughness of the machined surface was measured by a white light interferometer, and machined depth was measured by a VHX-1000. Through a comprehensive optimization to those results, optimal process parameters were obtained. In selected 25 sets of parameters, the variation of each parameter had little effect on the surface roughness. The factor having the greatest influence on the machined depth was the scanning speed, and the factor having the minimal influence was the scanning power. After comprehensive optimization, the best combination of process parameters could be obtained when the power was 20 W, the scanning speed was 200 mm/s, and the scanning layer was 25. The machined depth can experience a remarkable growth as the femtosecond laser power increases, the scanning speed decreases, or the canning layer increases. The width of upper surface of the mold obtained by the optimum processing parameters is 152 μm, the edges are neat, the depth is 42.41 μm, and the bottom surface roughness is 0.164 μm. The results of the study provide some reference for tungsten carbide microfluid grooves by femtosecond laser machining.