目的 方便快捷地研究高速电镀锡工艺，有效实现赫尔槽在高速镀锡液中的研究应用。方法 开发一种高速赫尔槽装置，以研究MSA高速镀锡工艺条件（温度、电流密度和流速）。采用增重法对不同电流密度下的镀液电流效率进行试验。通过扫描电镜和X射线衍射仪对镀层的微观形貌和结晶取向进行分析。结果 提高MSA镀锡电解液平行液流流速，工作电流密度可提高到40 A/dm2，电流效率仍达90%以上。MSA高速镀锡的电镀工艺为：流速>146 cm/s，温度40~60 ℃，电流密度20~40 A/dm2。经实验验证，平板电极中镀液流速与阴极极限电流密度存在正比关系，与旋转圆盘电极极限扩散电流密度公式相似。高速下沉积厚度相同的锡镀层，随着沉积电流密度的增加，镀层晶面择优取向由（220）晶面转变为（321）晶面。 结论 相较于在静态赫尔槽试验中研究电镀工艺对镀液性能的影响，该设计可更好地反映实际生产的真实情况，可应用于电镀试验和工厂生产的质量管理。

To conveniently and quickly study the process of high-speed electroplating tin and apply Hull cell in high-speed tin plating liquid. A high-speed Hull cell device was designed experimentally to study the high-speed tin plating process conditions (temperature, current density, and flow rate) of MSA. The weighing method was used to test the current efficiency of bath at different current densities. The microstructure and crystal orientation of the coating were analyzed by scanning electron microscopy and X-ray diffractometry. With the increase of the flow rate of MSA electrolyzed electrolyte, the working current density was increased to 40 A/dm2, and the current efficiency was still over 90%; the electroplating process of MSA high-speed tin plating was: flow rate >146 cm/s, temperature 40~60 ℃, the current density was 20~40 A/dm2. The experimental results show that there was a positive relationship between the flow rate of the plating solution in the plate electrode and the limiting current density of the cathode, which was similar to the limiting diffusion current density formula of the rotating disk electrode. The XRD data of the same thickness tin deposition deposited at high speed can be obtained. With the increase of deposition current density, the preferred orientation of the crystal plane of the coating was changed from the (220) plane to the (321) plane. Compared with the effect of electroplating process on bath performance in a static Hull cell test, the design can better reflect the situation of actual production, and be applied to electroplating test and quality management of factory production.