目的 改善TiCN薄膜的组织结构，进一步提高其硬度与结合力。方法 采用电弧离子镀技术，通过改变脉冲偏压的幅值，制备一系列的TiCN薄膜。通过扫描电子显微镜（SEM）观察薄膜的表面和截面形貌，采用X射线衍射（XRD）对薄膜进行物相分析，用X射线光电子谱（XPS）表征元素的化学状态，通过能谱仪（EDS）分析薄膜的成分。采用显微维氏硬度计测量薄膜硬度，使用3D轮廓仪测量薄膜厚度，利用多功能材料表面性能试验仪进行划痕测试。结果 偏压对薄膜的硬度、结合力、组织结构和沉积速度都有影响。随着脉冲偏压的提高，TiCN薄膜晶粒逐渐细化，沉积速率、结合力有先增大后减小的趋势，TiCN薄膜的硬度保持线性提高。偏压为?200 V时，TiCN薄膜出现C3N4新相，此时薄膜的硬度和结合力都大幅度提高，表面形貌发生突变，液滴最多。偏压为?250 V时，TiCN薄膜综合性能最好，并且表面的液滴明显减少，此时硬度值为4017HV，结合力为51 N。结论 偏压对组织结构及碳元素在薄膜中的存在形式有一定影响，适当地改变脉冲偏压可以使TiCN薄膜的显微组织更加致密，同时，形成的弥散硬化相使薄膜具备较高的硬度和膜基结合强度。

The work aims to improve the microstructure of TiCN films and further increase hardness and adhesion. TiCN films were prepared with arc ion plating technology by changing the amplitude of pulsed bias. Surface and cross-section morphology, phase structure, chemical bonding structure and composition of the films were observed, analyzed and characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and energy dispersive spectrometer (EDS). The hardness of the films was measured by micro Vickers-hardness tester, the thickness was examined by 3D profiler, and the scarification test was carried by multifunctional material surface tester.Hardness, adhesion, texture and deposition rate of the films were strongly affected by pulsed bias. With the increase of pulsed bias, the grain size of TiCN films gradually refined and the deposition rate and adhesion strength firstly increased and then decreased, but the hardness of TiCN films kept linear growth. When the pulsed bias was –200 V, the new phase of C3N4 appeared in the TiCN films. The hardness and adhesion strength of the films greatly increased and the surface morphology changed suddenly and generated the most droplets. When the pulsed bias was –250 V, TiCN films showed the best performance , the droplets on the surface decreased obviously, the hardness was 4017HV and the adhesion strength was 51N.Pulsedbias has certain effects on the existence of microstructure and carbon in the films. Changing the pulsed bias properly can densify the microstructure of TiCN films and form the dispersion hardening phase to provide higher hardness and adhesion strength for films.