目的 在曲面金属表面制作微结构阵列。方法 提出一种采用界面转移法在曲面金属零件表面制作胶体粒子掩膜，并在胶体粒子间隙中电沉积金属制作微坑阵列的工艺。采用扫描电子显微镜和接触角测量仪，对沉积层的表面形貌和润湿性能进行检测。结果 采用界面转移法可以在金属零件表面形成均匀排列的单层胶体粒子掩膜，在0.3 A/dm2的电流密度下电沉积20 min去除粒子掩膜后，在曲面金属零件表面得到均匀排列的微坑阵列，单个微坑尺寸约为3.4 μm。在0.3 A/dm2的电流密度下电沉积10~50 min，微坑的尺寸随电沉积时间的增大而增大，疏水性随微坑尺寸的增大而先增大后减小，微坑尺寸为5 μm左右时，沉积层的疏水性最好，其圆柱面接触角约为120?。结论 采用界面转移方法制作胶体粒子掩膜并结合电沉积工艺，可以在曲面金属表面制作均匀的微坑阵列。带有微坑阵列的沉积层为疏水表面，通过调节电沉积电流密度和沉积时间可获得疏水性最好的微坑结构阵列。

The work aims to prepare the microstructure on free-curved surfaces of metal workpieces. A novel process to prepare colloidal particle mask on curved surfaces of metal workpiece by interface transfer method and fabricate micro-dimple array between colloidal particles by electrodepositing process was proposed. The monolayer colloidal particle mask could be formed on the curved surface of the metal workpiece by the interface transfer method. The micro-dimple array with a good uniformity was obtained by electrodepositing at current density of 0.3 A/dm2 for 20 min after the removal of the colloidal particle mask, and the diameter of single micro-dimple was about 3.4 μm. After electrodepositing for 20 min at current density of 0.3 A/dm2, the diameter of micro-dimples increased with the prolongation of the electrodepositing time, and the hydrophobicity of the deposited layers increased firstly and then decreased with the increase of the micro-dimple diameter. The deposited layer with best hydrophobicity was obtained when the diameter of the micro-dimple was about 5 μm, and the contact angle on the cylinder surface was about 120°. Micro-dimple array on the curved surface of the metal workpiece can be obtained by electrodeposition process with the colloidal particle mask formed by the interface transfer method. The deposited layer with the micro-dimple array is the hydrophobic surface. The micro-dimple array with the good hydrophobicity can be obtained by adjusting the electrodepositing time and the current density.