目的 添加稀土Nd改善金刚石/铜复合材料界面间的缺陷，抑制金刚石与铜之间的弱润湿性，增强复合材料的界面结合。方法 采用放电等离子烧结（SPS）技术制备含有不同质量分数Nd的镀钛金刚石/铜复合材料，采用扫描电子显微镜观察界面处的微观形貌，采用X射线衍射仪和X射线能谱仪分析界面处组织，采用排水法测试复合材料的密度和致密度。结果 添加稀土Nd后，金刚石-铜两相界面间促生了Cu5Nd、NdCu2、Cu3Ti等相。界面间的Cu5Nd、NdCu2、Cu3Ti、TiC填补了镀钛金刚石/铜复合材料界面处原有的空隙、孔洞等缺陷。未添加稀土Nd的镀钛金刚石/铜复合材料的密度为4.589 g/cm3，致密度为81%；添加3wt%的Nd元素后，镀钛金刚石/铜复合材料的密度和致密度分别达到了5.569 g/cm3和98%，密度较未添加Nd的复合材料提升了21%。随着Nd含量的增加，金刚石-铜界面间的缺陷逐渐减少，界面结合效果逐渐转好。 结论 稀土Nd极大地改善了镀钛金刚石/铜复合材料两相界面处的缺陷，很好地修饰了原本润湿性较差的金刚石-铜两相界面。添加Nd元素后，复合材料两相界面结合紧密。

The work aims to modify interfacial defects of diamond/copper composites, inhibit the weak wettability between diamond and copper and enhance the interfacial bonding of composites by adding rare earth neodymium. Spark plasma sintering (SPS) technique was performed to prepare titanium-coated diamond/copper composite with different mass fractions of rare earth Nd. Scanning electron microscopy (SEM) was used to observe the microstructure at the interface. X-ray diffraction and X-ray energy dispersive spectroscopy were used to analyze the structure at the interface, and the dewatering method was performed to test density and relative density of composites. After rare earth Nd was added, Cu5Nd, NdCu2, Cu3Ti and other phases were promoted at the diamond-copper interface. The defects such as the original voids and holes at the interface of diamond/copper composite were filled by Cu5Nd, NdCu2, Cu3Ti and TiC. The density of diamond/copper composite without Nd was 4.589 g/cm3, and the relative density was 81%; After 3wt% Nd was added, the density and relative density of the composites reached 5.569 g/cm3 and 98% respectively. The density was 21% higher than the composite without Nd. With the increase of Nd content, the defects at the diamond-copper interface gradually decreased, and the interface bonding turned better. Rare earth Nd greatly corrects the defects at the interface of Ti coated diamond/copper composite and modifies the interface with poor wettability between diamond and copper. Addition of Nd can make interface between composites bonded more closely.