随着光电通讯、生物医疗、航空航天等技术的飞速发展，高性能、高精度、高集成的零件及模具不断涌现，其不仅结构复杂，加工精度和表面质量要求高，而且大部分都属于硬、脆难加工材料，传统的抛光方法难以胜任。基于可控柔性理念的抛光技术，为上述零件的高效率和高精度抛光提供了一种新思路，逐渐成为超精密抛光的重要发展方向。首先，介绍了可控柔性抛光技术的基本概念，并就柔性执行装置、柔性“研抛模”、柔性控制系统三种可控柔性抛光方法的柔性可控原理、结构特点以及国内外研究现状等分别进行了综述；其次，对以上可控柔性抛光方法的加工原理、材料去除、抛光精度等进行了深入分析与比较，进一步阐述各类方法的优缺点；最后，对可控柔性抛光方法基本理论的系统研究、抛光精度和效率的提高、抛光工艺的复合化和智能化以及智能材料应用等方面的发展趋势进行了展望。

With the rapid development of photoelectric communication, biomedicine and aerospace technologies, parts and dies featuring in high performance, high precision and high integration are emerging constantly. These parts and dies are characterized by complex structure, and demanding machining accuracy and surface quality. Moreover, most of them are hard-brittle intractable materials, which makes it difficult to machine in conventional polishing methods. Allowing for the above problems, the polishing technology based on controllable flexibility concept provides a new idea for high-efficiency and high-precision polishing of the above-mentioned parts, and becomes a new development direction of ultra precision polishing. Firstly, basic concept of controllable flexible polishing (CFP) technology was introduced; and a review was made with regard to flexibility control principle, structural characteristics and research status at home and abroad of flexible actuator, flexible “polishing mold” and flexible control system, respectively. Then processing principle, material removal and polishing precision of above CFP methods were thoroughly analyzed and compared, advantages and disadvantages of various polishing methods were further expounded. Finally, future development trend of CFP methods were prospected in terms of systematic study on basic theory, improvement of polishing accuracy and effi-ciency, polishing process compounding and intelligentizing as well as application of intelligent materials.