目的 研究温度对铌酸锂晶片的磨削减薄影响。方法 利用恒温水浴装置对磨削减薄过程中的铌酸锂晶片进行温度控制，将铌酸锂晶片减薄至80 μm，并将温度分别控制在室温25、45、60、75 ℃，所用设备为卧式减薄机，杯形砂轮的转速为200 r/min，工件进给量为0.002 mm/min。结果 SEM结果显示，铌酸锂晶片磨削后会有不同程度的断裂。利用TEM测试发现，温度为25 ℃时，铌酸锂晶片是单晶结构。温度为45 ℃时，内部既有单晶结构，也有多晶结构。随着温度的上升，铌酸锂晶片多晶结构的比重逐渐增大，单晶结构越来越少。因此，温度对改变铌酸锂晶体的内部结构有着十分重大的意义。利用仿真软件COMSOL Multiphysics中特有的压电模块及多场耦合功能对本实验研究对象进行模拟仿真，结果表明，随着温度的变化，铌酸锂晶片的变形位移逐渐增大，铌酸锂晶片所受到的应力也逐渐增大，且边缘部分应力最大。结论 温度会直接影响铌酸锂晶片的内部结构，甚至会导致断裂破损量的增大，所以在加工过程中，需要控制温度的变化，以避免温度的不良影响。

The work aims to study effects of temperature on grinding and thinning process of LiNbO3 crystal plate. Horizontal grinder was used to reduce the thickness of LiNbO3 crystal plate to 80 μm. The speed of cup wheel was 200 r/min and feed rate of workpiece was 0.002 mm/min. A homoeothermic water-bath device was used to ensure that machining temperature was constant. The LiNbO3 crystal plates are grinded at different ambient temperature: 25, 45, 60, 75 ℃. The grinding affected its deformation and rupture. The LiNbO3 crystal was single-crystal at 25 ℃ and both single- and multi-crystal at 45 ℃. The proportion of multi-crystal structure increased while single-crystal structure decreased as temperature rose. Therefore, temperature had a significant effect on changing microstructure of LiNbO3 crystals. The study object was simulated based upon piezoelectric module and multi-field coupling function of COMSOL Multiphysics simulation software. The simulation indicated that, as temperature rose, both deformation displacement of LiNbO3 crystal chips and stress carried by the chips increased gradually, stress along the edges was the maximum. Temperature can directly affect internal structure of LiNbO3 crystal chips and even result in the increase of deformation displacement, so temperature should be controlled to avoid its negative effects.