目的 通过无氧铜特定清洗液的溶液配方实验、腐蚀机制测定以及清洗液浓度表征，为实现无氧铜稳定清洗提出技术方案。方法 采用铬酐和浓硫酸互配进行溶液配方实验并采用扫描电镜形貌和腐蚀速率对结果进行对比分析；采用电化学循环伏安法研究了铜浓度对腐蚀速率的影响；采用EDTA络合滴定法测定铜浓度和氧化还原滴定法测定六价铬浓度进行了分析。结果 60～80 g/L铬酐+40～60 mL/L硫酸+余量水的溶液清洗可以获得均一稳定的表面，其中铬酐发挥着氧化剂的作用，硫酸发挥着调整酸度的作用；适当的铜离子浓度对化学反应有促进作用，随着铜离子质量浓度增大至5 g/L以上，腐蚀动力减缓，腐蚀速率减慢。结论 提出了无氧铜稳定清洗的合适浓度，得出了腐蚀机制及溶液特性的具体结果。

The work aims to propose technical scheme for stable cleaning of oxygen-free copper by solution formulation experiment, corrosion mechanism determination and cleaning solution concentration characterization. Solution formulation experiment for the formula consisting of chromic anhydride and concentrated sulfuric acid was performed and results were compared and analyzed by SEM and corrosion rate. Effects of copper concentration on the corrosion rate were studied by electrochemical cyclic voltammetry. Copper concentration and Cr VI concentration in the solution were analyzed by EDTA complexometric titration and oxidation-reduction titration respectively. Solution with chromic anhydride of 60~80 g/L+sulfuric acid of 40~60 mL/L+residual water was feasible for cleaning and could obtain a uniform and stable surface. Chromic anhydride acted as an oxidizing agent due to its strong oxidation while sulfuric acid adjusted acidity of the solution. Appropriate concentration of copper ion had obvious auxo-action on chemical reaction. Excessive mass concentration of copper ions (>5 g/L) had inhibitory effect on corrosion kinetics and corrosion rate. The appropriate concentration of stable cleaning solution for oxygen-free copper is proposed and the specific results of the corrosion mechanism and solution characteristics are obtained.