| XU Ning-hui,LI Wei-wei,QIAN Jia,SUN Yun-qian.Component Optimization of Polishing Slurry for Silicon Substrate Wafer Based on Stable pH Value[J],51(12):277-284, 319 |
| Component Optimization of Polishing Slurry for Silicon Substrate Wafer Based on Stable pH Value |
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| DOI：10.16490/j.cnki.issn.1001-3660.2022.12.028 |
| KeyWord:polishing slurry silica hydrosol organic base pH buffer pH stabilizer polishing rate service life of polishing slurry surface roughness |
| Author | Institution |
| XU Ning-hui |
College of Electronic Information Engineering, Hebei University of Technology, Tianjin , China |
| LI Wei-wei |
College of Electronic Information Engineering, Hebei University of Technology, Tianjin , China |
| QIAN Jia |
College of Electronic Information Engineering, Hebei University of Technology, Tianjin , China |
| SUN Yun-qian |
College of Electronic Information Engineering, Hebei University of Technology, Tianjin , China |
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| Abstract: |
| In order to solve the problem that the pH value of polishing slurry on silicon substrate wafer is slowly decreasing with the increase of service time and poor buffering ability, and that the domestic nano-silica hydrosol has a large gap with the international level, the work aims to explore the effects of different proportioning formulas on polishing rate, service life of polishing slurry and surface roughness under the same pH value and optimize the polishing slurry for silicon wafer to meet the development requirements of semiconductor industry. |
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