| WANG You-liang,SHI Xiao-feng,CHEN Xiu-juan,ZHANG Wen-juan,FENG Ming.Polishing Performance of Magnetic Compound Fluid Based on Double Magnetic Field[J],51(11):360-372 |
| Polishing Performance of Magnetic Compound Fluid Based on Double Magnetic Field |
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| DOI：10.16490/j.cnki.issn.1001-3660.2022.11.034 |
| KeyWord:magnetic compound fluid doublemagnetic field polishing performance surface roughness magnetic field distribution forming characteristic |
| Author | Institution |
| WANG You-liang |
Lanzhou University of Technology, Lanzhou , China |
| SHI Xiao-feng |
Lanzhou University of Technology, Lanzhou , China |
| CHEN Xiu-juan |
Lanzhou University of Technology, Lanzhou , China |
| ZHANG Wen-juan |
Lanzhou University of Technology, Lanzhou , China |
| FENG Ming |
Wenzhou University, Zhejiang Wenzhou , China |
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| Abstract: |
| Magnetic field assisted magnetic compound fluid (MCF) polishing method is a novel ultra-precision surface machining technology. The work aims to develop an annular MCF (Magnetic Compound Fluid) polishing tool under the external doublemagnetic field to avoidthe damage of morphology accuracy of microstructure caused by traditional MCF polishing tool in the polishing process and explorethe basic performances of the proposed annular MCF polishing tool under the given experimental conditions.In addition, the effectsof processing parameters on the surface roughness of workpiece were studied in detail.The forming characteristics of MCF polishing tool under different given conditions were observed by industrial cameras. The characteristic parameters of the optimal MCF polishing tool were constructed by analyzing the forming parameters of MCF polishing tools quantitatively. When the magnet eccentricity r=2 mm and the MCF supply V=1.5 mL, the forming characteristics of MCF polishing tool were the best. The parameters of MCF tool were a=28.70 mm, b=26.90 mm, c1=1.58 mm, c2=1.30 mm, d0=48.60 mm, h=7.20 mm and di=26.50 mm. Afterwards, by analyzing the magnetic field intensity on the workpiece surface under the action of double magnetic field, a magnetic field vector model wasestablished. After drying the MCF polishing tool, the internal relationship between the magnetic field distribution and the macro morphology of the MCF polishing tool wasexplored. At the same time, the micro morphology of the magnetic cluster wasobserved with a metallographic microscope, and the internal characteristics of the MCF polishing tool wereanalyzed. The distribution direction of the magnetic cluster wasconsistent with the direction of the magnetic field vector. The iron powder wasdistributed along the direction of the magnetic force line, and the abrasive particles weredistributed outside the iron powder, α- Fibers wereinterspersed inside or between magnetic clusters, which also verifiedthe principle of MCF polishing. Finally, the polishing experiment was carried out with PC board, and the MCF components, the effectsof MCF components, revolution speed of the magnet nm, revolution speed of the MCF carrier nc and working gap Δ on the workpiece surface roughness were investigated to explore the optimal polishing parameters. The optimalprocess parameters with low surface roughness were obtained through polishing experiments. The best process parameters included the optimal MCF group distribution ratio of 40wt.% carbon iron powder, 12wt.% abrasive particle, 3wt.% α-cellulose and 45wt.% magnetic fluid (MF), the optimal revolution speed of the MCF carrier nc=300 r/min, the optimal revolution speed of the magnet nm=400 r/min, and the optimal work gap Δ=1 mm.Under the optimum process parameters, the surface roughness of workpiece after 20 min polishing decreases from 0.578 μm to 0.009 μm, which indicates the polished workpiece surface is smoother than that before polishing. In addition, the reduction rate of surface roughness Ra is as high as 98.44%, which proves that the annular MCF polishing tool has stable and efficient polishing ability under the action of doublemagnetic field. |
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