DUAN Shi-xiang,LYU Bing-hai,DENG Qian-fa.Effect of Abrasive Type on Shear Thickening Polishing of K9 Glass[J],51(11):337-346, 384
Effect of Abrasive Type on Shear Thickening Polishing of K9 Glass
  
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DOI:10.16490/j.cnki.issn.1001-3660.2022.11.032
KeyWord:shear thickening polishing  K9 glass  SiO2  CeO2  surface roughness
        
AuthorInstitution
DUAN Shi-xiang College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou , China
LYU Bing-hai College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou , China
DENG Qian-fa College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou , China
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Abstract:
      K9 glass is one of the most common materials of optical components. The work aims to polish K9 glass workpiece with shear thickening polishing method, use the surface roughness Sa of the workpiece as the evaluation index to study the polishing effect of different abrasive slurry on K9 glass. In this paper, four kinds of abrasives of diamond, CeO2, Al2O3 and SiO2, and mixed abrasive of diamond+SiO2 were used to prepare different shear thickening polishing slurry, and their rheological properties were measured. Firstly, under the same concentration of abrasives, four experiments with different abrasives (diamond, CeO2, Al2O3 and SiO2) were carried out. The changes in the surface roughness Sa of the workpieces at different polishing times were observed, and the polishing effects of the four slurries were compared. Then, the polishing results of CeO2 slurry and diamond+SiO2 mixed abrasive slurry were compared, and the material removal process of mixed abrasive slurry, CeO2 slurry, Al2O3 slurry, SiO2 slurry and diamond slurry were discussed.Experimental results indicated that the peak viscosity of diamond, CeO2 and Al2O3 slurry decreased in order, the viscosity of SiO2 slurry increased with the increase of shear rate, showing continuous shear thickening and the peak viscosity of the mixed abrasive particles (SiO2+diamond) slurry were higher than other slurries, the peak viscosity of 10wt.% SiO2+5wt.% diamond slurry was higher than that of 5wt.% SiO2+10wt.% diamond slurry, but the peak shear rate was lower than the latter, compared with other abrasives, SiO2 abrasive can increase the peak shear rate of shear-thickening slurry; After 35 mins' polishing, the surface roughness Sa of the workpiece reduced from (233.1±15.2)nm to (1.6±0.2)nm by CeO2 slurry; After 55 mins' polishing diamond slurry can reach (1.86±0.2)nm; The effect of Al2O3 slurry was the worst, the surface roughness Sa of the workpiece reduced to (58.6±1.5)nm with 55 mins' polishing. After 35 mins' polishing 5wt.% SiO2+10wt.% diamond slurry can reach (2.4±1.2)nm, but in the first 5 mins, 5wt.% SiO2+10wt.% diamond slurry can reach a lower surface roughness Sa compare with CeO2 slurry. After 5 mins' polishing with 10wt.% SiO2+5wt.% diamond slurry, the surface roughness Sa was 53.3% lower than that obtained by CeO2 slurry, and decreased from (230.7±10.5)nm to (1.43±0.9)nm after 35 min polishing. In the initial stage of polishing, the polishing efficiency increased with the increase of SiO2 concentration in the 5wt.% diamond slurry. CeO2 slurry and 10wt.% SiO2+5wt.% diamond slurry had the best polishing effect. The latter had higher polishing efficiency when the surface quality was low. SiO2 abrasive were filled between the molecular chains formed by the solid dispersed particles in the polishing slurry, complementing the large size abrasive. SiO2 abrasive will remove the smaller slightly rough peaks on the workpiece surface, while the diamond abrasive can remove the larger slightly rough peaks. The large and small abrasives act synergistically to efficiently remove the slightly rough peaks on the surface of the workpiece to obtain an ultra-smooth surface.
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