| DAI Bin,LI Xiao-zhou,XU Jin-kai,WANG Jing-dong,CHEN Guang-jun,WANG Mao-xun,WANG Shen.Amplitude Effect on Surface Morphology by Ultrasonic-assisted Grinding of C/SiC Composite[J],51(7):263-273 |
| Amplitude Effect on Surface Morphology by Ultrasonic-assisted Grinding of C/SiC Composite |
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| DOI：10.16490/j.cnki.issn.1001-3660.2022.07.026 |
| KeyWord:C/SiC composite ultrasonic-assisted machining surface quality surface roughness |
| Author | Institution |
| DAI Bin |
Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun , China |
| LI Xiao-zhou |
Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun , China |
| XU Jin-kai |
Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun , China |
| WANG Jing-dong |
Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun , China |
| CHEN Guang-jun |
Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun , China |
| WANG Mao-xun |
Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun , China |
| WANG Shen |
Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun , China |
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| Abstract: |
| The machining of C/SiC composite is one of the most challenging problems in mechanical machining. Conventional machining methods for machining C/SiC composites may lead to difficulty to remove the chips, the surface of poor quality characteristics, machining accuracy is difficult to guarantee. By ultrasonic vibration assisted grinding machining technology C/SiC composite material removal mode may be varied by adjusting the ultrasonic amplitude, material removal rate can be increased, a better surface quality can be obtained, thus becoming the new processing C/SiC Composites the way.In this paper, ultrasonic-assisted grinding technology is used to grind C/SiC composite. By adjusting the ultrasonic amplitude, the mode of material removal and the fiber damage, and the surface roughness Sa of the workpiece are measured at different cutting angles. The result shows:In the machining process, the C/SiC composite is removed mainly by brittleness, and the fiber is damaged in the mode of fiber fracture and fiber fragmentation. As the ultrasonic amplitude is increased, the material removal rate is significantly increased, and the surface quality is improved，and the surface roughness Sa measured at different cutting angles (0°, 45°, 90°, 135°) is significantly reduced, about 15% to 41%. Due to the effect of ultrasonic vibration, the material removal method of different fiber angles (0°, 45°, 90°, 135°) of C/SiC composite material has changed. Due to the effect of ultrasonic vibration, in the machining process, the fiber breakage and matrix fragmentation are removed. While the material removal rate is increased, the surface quality is significantly improved. With the increase of the ultrasonic amplitude, the surface roughness Sa of different fiber cutting angles (0°, 45°, 90°, 135°) is correspondingly reduced, and the degree of reduction of the different fiber cutting angle Sa is also different, specifically:45°>135°>90°>0°. |
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