| JIA Qian,ZHANG Bin,LAI Zhen-guo,ZHANG Jun-yan.Annealing Treatment of Hydrogenated Amorphous Carbon Film is Affected by Its Intrinsic Structure[J],51(7):98-106 |
| Annealing Treatment of Hydrogenated Amorphous Carbon Film is Affected by Its Intrinsic Structure |
| |
| View Full Text View/Add Comment Download reader |
| DOI：10.16490/j.cnki.issn.1001-3660.2022.07.009 |
| KeyWord:hydrogenated amorphous carbon film annealing bipolar pulse DC pulse plasma-enhanced chemical vapor deposition |
| Author | Institution |
| JIA Qian |
Key Laboratory of Science and Technology on Wear and Protection of Materials, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou , China;Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing , China |
| ZHANG Bin |
Key Laboratory of Science and Technology on Wear and Protection of Materials, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou , China;Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing , China |
| LAI Zhen-guo |
Key Laboratory of Science and Technology on Wear and Protection of Materials, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou , China;Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing , China |
| ZHANG Jun-yan |
Key Laboratory of Science and Technology on Wear and Protection of Materials, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou , China;Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing , China |
|
| Hits: |
| Download times: |
| Abstract: |
| Hydrogenated amorphous carbon (a-C:H) film was used in different field due to its excellent electrical, optical and tribological properties. With the evolution of the mechanic systems, the a-C:H film is required not only to have the performance of low friction coefficient, but also to meet the high temperature (≥350 ℃) service conditions. Thus, the thermal stability of the a-C:H film is the key point. The stability of a-C:H films is closely related to their inner structure, which depends on the preparation methods. So it is important to study the effects of different preparation methods on the nano structure of a-C:H films with variation of temperatures. The previous work mainly focused on the structural changes of specific a-C:H films at different annealing temperatures. However, there still lack of attention to the effect of film’s intrinsic structure on the annealing results. Thus, in this work, DC Pulsed Plasma Enhanced Chemical Vapor Deposition (PD-PECVD) and Bipolar Pulsed Plasma Enhanced Chemical Vapor Deposition (BiP-PECVD) were used to deposit two kinds of a-C:H films with different structures, then of which were annealed at 350 ℃, 450 ℃, 550 ℃ and 650 ℃, respectively. The variation of structural, mechanical properties, surface morphology and tribological properties of two kinds of a-C:H films were evaluated by appropriate testing methods. The results show that the deposition rate of a-C:H films, deposited via PD-PECVD method is 1.52 times higher than that of the BiP-PECVD method. With the increase of the annealing temperature, the a-C:H films prepared by the two methods all desorbed H but the transitional temperature point of desorption of H at 450 ℃ and 350 ℃, respectively. One can be also confirmed that the a-C:H film prepared by the PD-PECVD method is easier to form sp3-C during the H desorption process, while the a-C:H film prepared by the BiP-PECVD method has the same probability of forming sp3-C and sp2-C hybrid bonds. In addition, the a-C:H film, prepared by the BiP-PECVD method, is easier to lose H during the annealing process and peeled off in a large area beyond the annealing temperature of 450 ℃, resulting in friction failure. The a-C:H film prepared by the PD-PECVD method is unpeeled off and keep the friction coefficient as low as 0.06 when annealing at 350-550 ℃. To sum up, the film prepared by PD-PECVD method has better thermal, mechanical and tribological stability, which can work under high-temperature conditions. |
| Close |
|
|
|